The 533 Series of 13U AdvancedTCA systems is designed to the PICMG 3.0
AdvancedTCA specification. They support up to 14 slots at 30mm pitch front and rear with either a Dual Star or Full Mesh backplane topology.
All of the systems in this series have front accessible cooling modules to optimize power dissipation while minimizing MTTR. The high performance thermal management system contained within the 533 Series is comprised of six dual fan modules configured in a push pull orientation to provide the required airflow to cool 200 watts front side and 30 watts back side. The 533 series also features a front removable NEBs filtered intake.
Dual Redundant Shelf Management Modules, featuring Pigeon Point System or Motorola technology, are available in the 533 Series. These Shelf Management Modules reside in a dedicated rear panel slot, allowing the chassis and backplane to accommodate 14 slots of full size AdvancedTCA boards and their RTMs. All field replaceable units are intelligent devices and communicate to the Shelf Managers through the IPMI.
Rear access dual redundant EMC filtered -48V power entry modules are capable of handling 60A each and include an intelligent IPMI Controller and a FRU data module.
The 533 Series systems are designed to meet RoHS, NEBS, FCC Class A/B, UL 60950, and CE requirements.
Construction:
22.75” (13U)H x 17.2” W x 18.2”D
Zinc plated steel
Black medium texture finish
EMI gasketing and hardware spacing to support FCC B
Card Cage
:
Formed sheet metal card cage with integral slot ESD clip
(14) 8U x 280mm front slots
(14) 8U x 100mm rear slots
Cooling:
Front removable/washable inlet filter
Push pull redundant cooling design with (3) dual fan modules above and (3) dual fan modules below the card cage
200 Watts Front Side Cooling
30 Watts Back Side Cooling
Power Entry
:
(2) DC Input PEMs
(1) -48VDC A
(1) -48VDC B
Rear pluggable into backplane
Designed to carry 60A
IPMI Controller and FRU Data Module
The 533 Series of 13U AdvancedTCA systems is designed to the PICMG 3.0
AdvancedTCA specification. They support up to 14 slots at 30mm pitch front and rear with either a Dual Star or Full Mesh backplane topology.
All of the systems in this series have front accessible cooling modules to optimize power dissipation while minimizing MTTR. The high performance thermal management system contained within the 533 Series is comprised of six dual fan modules configured in a push pull orientation to provide the required airflow to cool 200 watts front side and 30 watts back side. The 533 series also features a front removable NEBs filtered intake.
Dual Redundant Shelf Management Modules, featuring Pigeon Point System or Motorola technology, are available in the 533 Series. These Shelf Management Modules reside in a dedicated rear panel slot, allowing the chassis and backplane to accommodate 14 slots of full size AdvancedTCA boards and their RTMs. All field replaceable units are intelligent devices and communicate to the Shelf Managers through the IPMI.
Rear access dual redundant EMC filtered -48V power entry modules are capable of handling 60A each and include an intelligent IPMI Controller and a FRU data module.
The 533 Series systems are designed to meet RoHS, NEBS, FCC Class A/B, UL 60950, and CE requirements.
Construction:
- 22.75” (13U)H x 17.2” W x 18.2”D
- Zinc plated steel
- Black medium texture finish
- EMI gasketing and hardware spacing to support FCC B
Card Cage
:
- Formed sheet metal card cage with integral slot ESD clip
- (14) 8U x 280mm front slots
- (14) 8U x 100mm rear slots
Cooling:
- Front removable/washable inlet filter
- Push pull redundant cooling design with (3) dual fan modules above and (3) dual fan modules below the card cage
- 200 Watts Front Side Cooling
- 30 Watts Back Side Cooling
Power Entry
:
- (2) DC Input PEMs
- (1) -48VDC A
- (1) -48VDC B
- Rear pluggable into backplane
- Designed to carry 60A
- IPMI Controller and FRU Data Module
