The LF series comprises super high density BGA heat sinks made of Al 1070 with a black anodized finish, designed for thermal management of chipsets with a 12x12 mm heat source. The heat sinks are available in three heights-6 mm, 10 mm, and 13 mm-with a consistent 2.0 mm base thickness and footprint sizes ranging from 19x19 mm to 45x45 mm. Thermal resistance values are specified at 200 LFM air velocity, with performance improving as height increases and footprint enlarges. Thermal performance is characterized under forced air conditions up to 800 LFM.
Standard Products sizes ranging from 7mm x 7mm to 117mm x 61mm are listed below.
Customization is available. Please contact us directly!
Features & Benefits-
-Fins and base are one piece construction, an integral forming piece
-High aspect ratio up to 1: 100, increases the surface heat dissipation area
-Aluminum alloy, pure aluminum, copper and copper based with aluminum fin are doable materials
-To ensure no taper fins, to improve airflow smooth through
-High material density, increases thermal conductivity
-A wide range of geometric patterns - Line fins, Pin fins, Elliptical fins are available
| Rego Electronics Inc. | |
|---|---|
| Product Category | Heat Sinks |
| Product Number | LF Series |
| Product Name | Forged Heat Sinks |
| L | 19 to 40 mm (0.7480 to 1.57 inch) |
