4” - 12” Wafer Diameter Capacity.
Process up to two (2) wafers simultaneously or choose insitu pad conditioning.
Compact, space-efficient systems.
True CMP processing without a CMP system price.
Can be used on Semiconductor, Compound Semiconductor (hard) and MEMS/NEMS substrate materials.
Fully programmable and independent kinematics for platen drive : Polishing head drives, polishing head pressure, polishing head oscillation & speed.
Operator’s control touch-screen interface.
Menu-driven operations software.
Non-corrosive & low-expansion material construction.
Multi-Processing : Quick-change platen & polishing heads.
Precision Surfacing Solutions
Done
Description
4” - 12” Wafer Diameter Capacity.
Process up to two (2) wafers simultaneously or choose insitu pad conditioning.
Compact, space-efficient systems.
True CMP processing without a CMP system price.
Can be used on Semiconductor, Compound Semiconductor (hard) and MEMS/NEMS substrate materials.
Fully programmable and independent kinematics for platen drive : Polishing head drives, polishing head pressure, polishing head oscillation & speed.
Operator’s control touch-screen interface.
Menu-driven operations software.
Non-corrosive & low-expansion material construction.
Multi-Processing : Quick-change platen & polishing heads.
4” - 12” Wafer Diameter Capacity.
Process up to two (2) wafers simultaneously or choose insitu pad conditioning.
Compact, space-efficient systems.
True CMP processing without a CMP system price.
Can be used on Semiconductor, Compound Semiconductor (hard) and MEMS/NEMS substrate materials.
Fully programmable and independent kinematics for platen drive : Polishing head drives, polishing head pressure, polishing head oscillation & speed.
Operator’s control touch-screen interface.
Menu-driven operations software.
Non-corrosive & low-expansion material construction.
Multi-Processing : Quick-change platen & polishing heads.
4” - 12” Wafer Diameter Capacity.
Process up to two (2) wafers simultaneously or choose insitu pad conditioning.
Compact, space-efficient systems.
True CMP processing without a CMP system price.
Can be used on Semiconductor, Compound Semiconductor (hard) and MEMS/NEMS substrate materials.
Fully programmable and independent kinematics for platen drive : Polishing head drives, polishing head pressure, polishing head oscillation & speed.
Operator’s control touch-screen interface.
Menu-driven operations software.
Non-corrosive & low-expansion material construction.
