The CMI760 PCB Thru-Hole and Copper Thickness Gauge is designed for precise measurement of copper thickness in various PCB applications, including surface and thru-hole measurements. It features dual technology, utilizing both micro-resistance and eddy current methods, which allows for accurate readings on multi-layer boards and different copper types. The gauge comes standard with the SRP-4 probe, which has user-replaceable tips and a durable design, making it suitable for field applications. An optional ETP probe is available for enhanced eddy current measurements, providing temperature compensation for immediate readings after plating. The device has a measurement range of 1-102 µm for thru-hole copper and offers a resolution of 0.001 µm for precise readings. It includes a large backlit LCD display with statistical capabilities, allowing users to view readings, standard deviation, and trends. The CMI760 is A2LA certified for coating thickness calibrations, ensuring compliance with ISO 17025 standards. Its compact dimensions and lightweight design make it a practical choice for engineers seeking a reliable and versatile thickness gauge for PCB manufacturing.
The CMI760 PCB Thru-Hole & Copper Surface Measurement Gauge is a benchtop coating thickness gauge that is specifically designed for PCB electronics manufacturers.
Highly versatile, the CMI760 coating thickness gauge is designed for those applications that require quick, easy, accurate and repeatable thru-hole measurements on PCB boards as well as measurements of copper plating on rigid, flexible, single and double-sided or multi-layer PCB boards.
| Hitachi High-Tech America | |
|---|---|
| Product Category | Nondestructive Testing (NDT) Probes |
| Product Number | CMI760 |
| Product Name | PCB Thru-Hole and Copper Thickness Gauge |
| NDT Probe Technology | Eddy Current |
