Master Bond, Inc. Fast Curing, Thermal Cycling Resistant Epoxy Adhesive EP51M

Description
Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The bonding strength is relatively insensitive to cleaning procedures. Master Bond EP51M gels in about 3 minutes and cures within a few hours at ambient temperatures. Bonded parts can be safely handled within a half hour. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of 4K to +250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Master Bond EP51M adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. It is suggested that Master Bond EP51M be mixed in small quantities because of its fast gelling properties. It is highly recommended for production line assemblies and high speed bonding operations. EP51M is also an excellent adhesive/ sealant for cryogenic applications.
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Description
Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The bonding strength is relatively insensitive to cleaning procedures. Master Bond EP51M gels in about 3 minutes and cures within a few hours at ambient temperatures. Bonded parts can be safely handled within a half hour. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of 4K to +250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Master Bond EP51M adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. It is suggested that Master Bond EP51M be mixed in small quantities because of its fast gelling properties. It is highly recommended for production line assemblies and high speed bonding operations. EP51M is also an excellent adhesive/ sealant for cryogenic applications.
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Suppliers

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Product
Description
Supplier Links
Fast Curing, Thermal Cycling Resistant Epoxy Adhesive - EP51M - Master Bond, Inc.
Hackensack, NJ, USA
Fast Curing, Thermal Cycling Resistant Epoxy Adhesive
EP51M
Fast Curing, Thermal Cycling Resistant Epoxy Adhesive EP51M
Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The bonding strength is relatively insensitive to cleaning procedures. Master Bond EP51M gels in about 3 minutes and cures within a few hours at ambient temperatures. Bonded parts can be safely handled within a half hour. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of 4K to +250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Master Bond EP51M adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. It is suggested that Master Bond EP51M be mixed in small quantities because of its fast gelling properties. It is highly recommended for production line assemblies and high speed bonding operations. EP51M is also an excellent adhesive/ sealant for cryogenic applications.

Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The bonding strength is relatively insensitive to cleaning procedures. Master Bond EP51M gels in about 3 minutes and cures within a few hours at ambient temperatures. Bonded parts can be safely handled within a half hour. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of 4K to +250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Master Bond EP51M adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. It is suggested that Master Bond EP51M be mixed in small quantities because of its fast gelling properties. It is highly recommended for production line assemblies and high speed bonding operations. EP51M is also an excellent adhesive/ sealant for cryogenic applications.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP51M
Product Name Fast Curing, Thermal Cycling Resistant Epoxy Adhesive
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Chemical System Epoxy
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