Master Bond, Inc. Highly Flexible Epoxy Features Low Exotherm EP37-3FLF

Description
Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a forgiving one-to-one mix ratio by weight or volume. As an adhesive, it forms very flexible high strength bonds that offer excellent impact resistance as well as resistance to severe thermal cycling and shock. It bonds well to a wide variety of substrates including metals, glass, ceramics, rubber and many plastics. EP37-3FLF is also a superb potting, encapsulating and casting system. Its relatively low exotherm makes it an ideal material for large castings. In this regard it also possesses superior electrical insulation properties. The combination of high flexibility and lower exotherm helps prevent EP37-3FLF from stressing sensitive electronic components during cure. Also noteworthy is the long working life which, depending upon mass, could offer an hour or two at room temperature conditions. EP37-3FLF is serviceable over the very wide temperature range form from 4K to +250°F. This versatile system is widely used in optical, electronic, electrical, computer and OEM type applications.
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Description
Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a forgiving one-to-one mix ratio by weight or volume. As an adhesive, it forms very flexible high strength bonds that offer excellent impact resistance as well as resistance to severe thermal cycling and shock. It bonds well to a wide variety of substrates including metals, glass, ceramics, rubber and many plastics. EP37-3FLF is also a superb potting, encapsulating and casting system. Its relatively low exotherm makes it an ideal material for large castings. In this regard it also possesses superior electrical insulation properties. The combination of high flexibility and lower exotherm helps prevent EP37-3FLF from stressing sensitive electronic components during cure. Also noteworthy is the long working life which, depending upon mass, could offer an hour or two at room temperature conditions. EP37-3FLF is serviceable over the very wide temperature range form from 4K to +250°F. This versatile system is widely used in optical, electronic, electrical, computer and OEM type applications.
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Suppliers

Company
Product
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Supplier Links
Highly Flexible Epoxy  Features Low Exotherm - EP37-3FLF - Master Bond, Inc.
Hackensack, NJ, USA
Highly Flexible Epoxy Features Low Exotherm
EP37-3FLF
Highly Flexible Epoxy Features Low Exotherm EP37-3FLF
Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a forgiving one-to-one mix ratio by weight or volume. As an adhesive, it forms very flexible high strength bonds that offer excellent impact resistance as well as resistance to severe thermal cycling and shock. It bonds well to a wide variety of substrates including metals, glass, ceramics, rubber and many plastics. EP37-3FLF is also a superb potting, encapsulating and casting system. Its relatively low exotherm makes it an ideal material for large castings. In this regard it also possesses superior electrical insulation properties. The combination of high flexibility and lower exotherm helps prevent EP37-3FLF from stressing sensitive electronic components during cure. Also noteworthy is the long working life which, depending upon mass, could offer an hour or two at room temperature conditions. EP37-3FLF is serviceable over the very wide temperature range form from 4K to +250°F. This versatile system is widely used in optical, electronic, electrical, computer and OEM type applications.

Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a forgiving one-to-one mix ratio by weight or volume. As an adhesive, it forms very flexible high strength bonds that offer excellent impact resistance as well as resistance to severe thermal cycling and shock. It bonds well to a wide variety of substrates including metals, glass, ceramics, rubber and many plastics. EP37-3FLF is also a superb potting, encapsulating and casting system. Its relatively low exotherm makes it an ideal material for large castings. In this regard it also possesses superior electrical insulation properties. The combination of high flexibility and lower exotherm helps prevent EP37-3FLF from stressing sensitive electronic components during cure. Also noteworthy is the long working life which, depending upon mass, could offer an hour or two at room temperature conditions. EP37-3FLF is serviceable over the very wide temperature range form from 4K to +250°F. This versatile system is widely used in optical, electronic, electrical, computer and OEM type applications.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP37-3FLF
Product Name Highly Flexible Epoxy Features Low Exotherm
Cure / Technology Thermoset; Two Component  
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Epoxy
Composition Unfilled
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