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Master Bond, Inc. Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation EP29LPTCHT

Description
Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation.
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Product
Description
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Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation - EP29LPTCHT - Master Bond, Inc.
Hackensack, NJ, USA
Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation
EP29LPTCHT
Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation EP29LPTCHT
Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation.

Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Adhesives
Product Number EP29LPTCHT
Product Name Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Epoxy
Type / Form Liquid
Features High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Thermally Conductive
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
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