During exposure, the photoresist undergoes cross‑linking, creating highly stable regions that become insoluble in standard liquid developers, ensuring precise pattern retention. With its excellent optical transparency above 360 nm, SU‑8 enables the formation of near‑vertical sidewalls even in very thick film layers, making it ideal for high‑aspect‑ratio microstructures.
Because of its long‑term stability and strong material properties, SU‑8 is best suited for permanent microfabrication applications where the patterned resist remains in place after imaging and curing.
Key Features
High aspect ratio imaging with near vertical sidewalls
Near UV (350-400 nm) processing
Superb chemical and temperature resistance
Film thicknesses from 2 to 200 μm with single spin coat processes
During exposure, the photoresist undergoes cross‑linking, creating highly stable regions that become insoluble in standard liquid developers, ensuring precise pattern retention. With its excellent optical transparency above 360 nm, SU‑8 enables the formation of near‑vertical sidewalls even in very thick film layers, making it ideal for high‑aspect‑ratio microstructures.
Because of its long‑term stability and strong material properties, SU‑8 is best suited for permanent microfabrication applications where the patterned resist remains in place after imaging and curing.
Key Features
- High aspect ratio imaging with near vertical sidewalls
- Near UV (350-400 nm) processing
- Superb chemical and temperature resistance
- Film thicknesses from 2 to 200 μm with single spin coat processes
