NIL resist with excellent curing and nanoimprint performance in combination with PDMS soft stamp materials.
Increased dry etching resistance in demanding plasma processes
Excellent reproducibility enabling high volume production
Film thickness adjustable from sub 100 nm range up to several microns
NIL resist with excellent curing and nanoimprint performance in combination with PDMS soft stamp materials.
- Increased dry etching resistance in demanding plasma processes
- Excellent reproducibility enabling high volume production
- Film thickness adjustable from sub 100 nm range up to several microns
