Epoxy fluxes are often used in no-clean SMT component attach applications. The solder bumps on wafer level CSP, micro BGA or BGA packages are dipped in epoxy fluxes, or the flux is applied to the substrate via a jetting process. The assembly is then reflowed, and the epoxy flux acts to both clean up the solder joints before reflow, and to reinforce the final joint from the cured polymer.
| Indium Corporation | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | PK-005 |
| Product Name | Flip-Chip Epoxy Flux |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
