RS Components, Ltd. 547326

Non-activated No-Clean solder alloy with incorporated resinous flux. Designed for SMD repair applications. Excellent wetting on tin-plated substrates. Generates minimal fumes and residue. Chlorine: 0 %. Flux ratio: 1.5 %. Class J-STD-004 ROL0. Wire Diameter = 0.5mm Percent Lead = 40% Product Form = Wire Melting Point = +183 - +190°C Percent Tin = 60% Flux Type = Rosin Product Weight = 500g Flux Content Percent = 2.6%