Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems. This product formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today’s high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-Free metallizations and has exceptional low voiding performance on fine-pitch components, including BGA’s and CSP’s.
| Indium Corporation | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | Indium3.2HF Water-Soluble Solder Paste |
| Product Name | Solder Paste |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
