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Hernon Manufacturing, Inc. Formulations - Applications - Bonding - Tuffbond 321 3321AB22

Description
Tuffbond® 321 is a flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties.
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Suppliers

Company
Product
Description
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Formulations - Applications - Bonding - Tuffbond 321 - 3321AB22 - Hernon Manufacturing, Inc.
Sanford, FL, United States
Formulations - Applications - Bonding - Tuffbond 321
3321AB22
Formulations - Applications - Bonding - Tuffbond 321 3321AB22
Tuffbond® 321 is a flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties.

Tuffbond® 321 is a flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties.

Supplier's Site Datasheet

Technical Specifications

  Hernon Manufacturing, Inc.
Product Category Industrial Adhesives
Product Number 3321AB22
Product Name Formulations - Applications - Bonding - Tuffbond 321
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
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