The XTend4130 is a 3U VPX development backplane designed in accordance with OpenVPX™ system architecture specifications that supports one or two centralized switches for a single or dual star topology. When one switch is used, the XTend4130 provides a single star centralized switching topology. When two centralized switches are installed, the XTend4130 supports redundancy on both the control and data planes with a dual star implementation.
The XTend4130 provides VITA 46.10 RTM connectors for each payload slot and switch slot, and supports up to two parallel VITA 62.0 power supplies. The XTend4130 also supports power sourced from a development DC-DC power supply.
X-ES backplanes are available as an integrated component of our embedded systems, and are not sold separately.
Features
OpenVPX™-compliant
Six 3U VPX payload slots
Two 3U VPX switch slots in single or dual star topology
Two VITA 62.0 power supply slots
Supports development DC-DC power supply
Fat Pipe data plane in dual star topology
Ultra Thin Pipe control plane in dual star topology
VITA 46.10 RTM support for all payload and switch slots
1.0 in. pitch
Technical Specs
Payload Slots
Six 3U VPX payload slots
Two x4 Fat Pipes per slot (data plane)
Two x1 Ultra Thin Pipes per slot (control plane)
Switch Slots
Two 3U VPX switch slots
Six x4 Fat Pipes per slot (data plane)
Six x1 Ultra Thin Pipes per slot (control plane)
Single star or dual star redundant switch configuration
XChange3012-compatib
le
Power Slots
Two VITA 62.0 power supply slots
Supports development DC-DC power supply
12 V, 5 V, 3.3 V and ±12 V_AUX, 3.3 V_AUX
VITA 46.10 RTM
VITA 46.10 Rear Transition Module (RTM) connectors on each payload and switch slot for rear I/O
Bandwidth
Data plane routing supports up to 8 GBaud transfer rates
Control plane routing supports up to 8 GBaud transfer rates
Physical Dimension
3U VPX form factor
129 mm x 258 mm
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
Supported ruggedization levels (see the X-ES Ruggedization Chart): 1
Conformal coating available as an ordering option
The XTend4130 is a 3U VPX development backplane designed in accordance with OpenVPX™ system architecture specifications that supports one or two centralized switches for a single or dual star topology. When one switch is used, the XTend4130 provides a single star centralized switching topology. When two centralized switches are installed, the XTend4130 supports redundancy on both the control and data planes with a dual star implementation.
The XTend4130 provides VITA 46.10 RTM connectors for each payload slot and switch slot, and supports up to two parallel VITA 62.0 power supplies. The XTend4130 also supports power sourced from a development DC-DC power supply.
X-ES backplanes are available as an integrated component of our embedded systems, and are not sold separately.
Features
- OpenVPX™-compliant
- Six 3U VPX payload slots
- Two 3U VPX switch slots in single or dual star topology
- Two VITA 62.0 power supply slots
- Supports development DC-DC power supply
- Fat Pipe data plane in dual star topology
- Ultra Thin Pipe control plane in dual star topology
- VITA 46.10 RTM support for all payload and switch slots
- 1.0 in. pitch
Technical Specs
Payload Slots
- Six 3U VPX payload slots
- Two x4 Fat Pipes per slot (data plane)
- Two x1 Ultra Thin Pipes per slot (control plane)
Switch Slots
- Two 3U VPX switch slots
- Six x4 Fat Pipes per slot (data plane)
- Six x1 Ultra Thin Pipes per slot (control plane)
- Single star or dual star redundant switch configuration
- XChange3012-compatible
Power Slots
- Two VITA 62.0 power supply slots
- Supports development DC-DC power supply
- 12 V, 5 V, 3.3 V and ±12 V_AUX, 3.3 V_AUX
VITA 46.10 RTM
- VITA 46.10 Rear Transition Module (RTM) connectors on each payload and switch slot for rear I/O
Bandwidth
- Data plane routing supports up to 8 GBaud transfer rates
- Control plane routing supports up to 8 GBaud transfer rates
Physical Dimension
- 3U VPX form factor
- 129 mm x 258 mm
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 1
- Conformal coating available as an ordering option