Extreme Engineering Solutions, Inc. (X-ES) 13th Gen Intel® Core™ i7 Processor-Based 3U VPX-REDI Module with 64 GB of LPDDR5 and Microsemi® PolarFire™ SoC FPGA XPedite8270

The XPedite8270 is a secure, high-performance, 3U VPX-REDI, single board computer aligned to the Sensor Open System Architecture (SOSA) standard. Based on the 13th Gen Intel® Core™ i7 series (formerly Raptor Lake-P) line of processors, the XPedite8270 is an ideal choice for applications requiring maximum data and information protection along with high performance and power savings. The XPedite8270 integrates SecureCOTS™ technology with a Microsemi® PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required. The XPedite8270 provides fast and efficient I/O with one 40GBASE-KR4, two 10GBASE-KR, and one 10/100/1000BASE-T Ethernet ports. It supports 64 GB of LPDDR5 ECC SDRAM in addition to numerous I/O ports, including USB 2.0, PCI Express, RS-232 or RS-422/485 serial, and DisplayPort video through the backplane connectors. The XPedite8270 provides additional expansion capabilities by including an integrated XMC site. This XMC site includes a x4 PCI Express connection to the Intel® Core™ i7 processor and X12d, X16s, and X8d I/O mapped directly to the VPX backplane connectors. Wind River VxWorks and X-ES Enterprise Linux (XEL) Board Support Packages (BSPs) are available. Features Supports 13th Gen Intel® Core™ i7 series (formerly Raptor Lake-P) processors Designed with SecureCOTS™ technology to support enhanced security and trusted computing Microsemi® PolarFire™ SoC FPGA with 256 MB SPI NOR flash 3U VPX (VITA 46) module Compatible with multiple VITA 65 OpenVPX™ slot profiles Ruggedized Enhanced Design Implementation (REDI) per VITA 48 64 GB of LPDDR5 ECC SDRAM 256 GB of UFS NAND flash XMC site with x4 PCI Express interface and rear I/O support One 40GBASE-KR4 Ethernet port Two 10GBASE-KR Ethernet ports One 10/100/1000BASE-T Ethernet port One x4 Gen4 and one x2 Gen3 PCI Express interfaces Two USB 2.0 ports Two RS-232 serial ports or one RS-422/485 serial port One DisplayPort interface SOSA-aligned to AMPS profile MODA3-16.2.15-1-F2C- (E8)(P4F)(2E7-E3)(N- D1-U1-U1-M3/M4/M5-G1 ) (compatibility with other profiles may be possible, contact factory for options) Wind River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Contact factory for availability of Microsoft Windows drivers and other operating systems Technical Specs Processor Supports 13th Gen Intel® Core™ i7 series (formerly Raptor Lake-P) processors Memory 64 GB of LPDDR5 ECC SDRAM 256 GB of UFS NAND flash 64 MB NOR boot flash 64 kB EEPROM Security and Management Microsemi® PolarFire™ SoC FPGA with 256 MB SPI NOR flash Designed with SecureCOTS™ technology to support enhanced security and trusted computing System voltage monitor, power-on/reset control, non-volatile write-protection control Trusted Platform Module (TPM) 2.0 IPMI Controller (IPMC), supporting Tier 1, Tier 2, and Tier 3 operating modes VPX (VITA 46) P0 I/O Two IPMB connections to an IPMI Controller VPX (VITA 46) P1 I/O One 40GBASE-KR4 Ethernet port to P1.A Two 10GBASE-KR Ethernet ports One x4 PCI Express Gen4-capable interface XMC X12d I/O One maintenance serial port, software configurable to LVTTL or RS-232 One single-ended FPGA GPIO VPX (VITA 46) P2 I/O One 10/100/1000BASE-T Ethernet port One DisplayPort HBR2-capable interface One x2 PCI Express Gen3-capable interface Two USB 2.0 ports Two RS-232 serial ports or one RS-422/485 serial port Three single-ended FPGA GPIOs XMC X8d I/O XMC X16s I/O Software Support UEFI firmware Wind River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Contact factory for availability of Microsoft Windows drivers and other operating systems XMC Site One x4 PCI Express Gen3-capable interface Physical Characteristics 3U VPX-REDI conduction- or air-cooled form factor SOSA-aligned to AMPS profile MODA3-16.2.15-1-F2C- (E8)(P4F)(2E7-E3)(N- D1-U1-U1-M3/M4/M5-G1 ) (compatibility with other profiles may be possible, contact factory for options) Dimensions: 100 mm x 160 mm 1.0 in. pitch with Two-Level Maintenance (2LM) support Environmental Requirements Contact factory for appropriate board configuration based on environmental requirements Supported ruggedization levels (see the X-ES Ruggedization Chart): 5 Conformal coating available as an ordering option Thermal performance will vary based on CPU frequency and application Contact X-ES for air-cooled development options Power Requirements Power will vary based on configuration and usage. Please consult factory.