Extreme Engineering Solutions, Inc. (X-ES) Intel® Xeon® D-2800 Processor-Based 3U VPX-REDI Module with 64 GB of DDR4, 100 Gigabit Ethernet, and SecureCOTS™ XPedite7872

The XPedite7872 is a secure, high performance single board computer aligned to the Sensor Open System Architecture (SOSA) standard. It is based on the Intel® Xeon® D-2800 series (formerly Eddy Lake) of processors, making it an optimal choice for computationally heavy applications requiring maximum data and information protection. This 3U VPX-REDI module integrates SecureCOTS™ technology with a Microsemi® PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required. The XPedite7872 provides incredible speed with one 100GBASE-KR4 Ethernet port, one 25G/10GBASE-KR Ethernet port, and one 1000BASE-KX Ethernet port. The XPedite7872 also accommodates up to 64 GB of DDR4 ECC SDRAM in four channels and up to 256 GB of onboard NAND flash, in addition to four x4 PCI Express Gen3-capable interfaces (also configurable as two x8 interfaces or one x16 interface). The XPedite7872 is compatible with SOSA slot profiles SLT3-PAY-1F1U1S1S1U1 U4F1J-14.6.11-0 and SLT3-PAY-1F1U1S1S1U1 U4F1J-14.6.13-0, and is the perfect fit for high-throughput compute workloads, delivering the performance and scalability needed for demanding applications. Wind River VxWorks and X-ES Enterprise Linux (XEL) Board Support Packages (BSPs) are available. Features Supports Intel® Xeon® D-2800 series (formerly Eddy Lake) processors Up to 20 Xeon®-class cores in a single, power-efficient SoC package SKUs available with native extended temperature support Designed with SecureCOTS™ technology to support enhanced security and trusted computing Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash 3U VPX (VITA 46) module Compatible with multiple VITA 65 OpenVPX™ slot profiles Ruggedized Enhanced Design Implementation (REDI) per VITA 48 64 GB of DDR4 ECC SDRAM in four channels 256 GB of onboard NAND flash One 100GBASE-KR4 Ethernet port One 25G/10GBASE-KR Ethernet port One 1000BASE-KX Ethernet port Four x4 Gen3-capable PCI Express interfaces (can also be configured as two x8 interfaces or one x16 interface) Two RS-232 and LVCMOS/LVTTL 3.3 V-configurable serial maintenance ports RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support Compatible with SOSA slot profiles SLT3-PAY-1F1U1S1S1U1 U4F1J-14.6.11-0 and SLT3-PAY-1F1U1S1S1U1 U4F1J-14.6.13-0 Wind River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Contact factory for PCI Express Gen4 and alternative Ethernet configuration availability Contact factory for availability of Microsoft Windows drivers and other operating systems Technical Specs Processor Intel® Xeon® D-2800 series (formerly Eddy Lake) processor Up to 20 Xeon®-class cores in a single, power-efficient SoC package SKUs available with native extended temperature support Memory 64 GB of DDR4 ECC SDRAM in four channels 256 GB of onboard NAND flash 64 MB NOR boot flash 64 kB EEPROM Security and Management Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash Designed with SecureCOTS™ technology to support enhanced security and trusted computing System voltage monitor, power-on/reset control, non-volatile write-protection control Trusted Platform Module (TPM) VPX (VITA 46) P1 I/O One 100GBASE-KR4 Ethernet port to P1.A One 25G/10GBASE-KR Ethernet port and one 1000BASE-KX Ethernet port to P1.B Ethernet ports allow up to 100 Gbps aggregate processor throughput One FPGA LVDS pair Two RS-232 and LVCMOS/LVTTL 3.3 V-configurable serial maintenance ports One single-ended FPGA GPIO One x4 PCI Express Gen3-capable interface to P1.C One x4 PCI Express Gen3-capable interface to P1.D VPX (VITA 46) P2 I/O One x4 PCI Express Gen3-capable interface to P2.A One x4 PCI Express Gen3-capable interface to P2.B Software Support RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support UEFI firmware Wind River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Contact factory for availability of Microsoft Windows drivers and other operating systems Physical Characteristics 3U VPX-REDI conduction-cooled form factor Compatible with SOSA slot profiles SLT3-PAY-1F1U1S1S1U1 U4F1J-14.6.11-0 and SLT3-PAY-1F1U1S1S1U1 U4F1J-14.6.13-0 Dimensions: 100 mm x 160 mm 0.8 in. pitch without solder-side cover 1.0 in. pitch with Two-Level Maintenance (2LM) support Environmental Requirements Contact factory for appropriate board configuration based on environmental requirements Supported ruggedization levels (see the X-ES Ruggedization Chart): 5 Conformal coating available as an ordering option Thermal performance will vary based on CPU frequency and application Contact X-ES for air-cooled development options Power Requirements SOSA Power: +12 V and +3.3 V_AUX (+5 V and +3.3 V not required)