Extreme Engineering Solutions, Inc. (X-ES) Intel® Xeon® D-2800 Processor-Based 3U VPX-REDI Module with 64 GB of DDR4, 100 Gigabit Ethernet, and SecureCOTS™ XPedite7871

Description
The XPedite7871 is a secure, high-performance single board computer based on the Intel® Xeon® D-2800 series (formerly Eddy Lake) of processors, making it an optimal choice for computationally heavy applications requiring maximum data and information protection. This 3U VPX-REDI module integrates SecureCOTS™ technology with a Microsemi® PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required. The XPedite7871 provides incredible speed with one 100GBASE-KR4, up to two 10GBASE-KR, and one 10/100/1000BASE-T Ethernet ports. It accommodates up to 64 GB of DDR4 ECC SDRAM in four channels and up to 32 GB of onboard SLC NAND flash in addition to numerous I/O ports, including USB 2.0, PCIe, and RS-232/422/485 serial through the backplane connectors. The XPedite7871 offers a SOSA-aligned pinout compatible with backplane slot profile 1F1F2U1TU1T1U1T-14.2 .16. The AMPS profile is MODA3-16.2.15-1-F2C- (E8)(P3F)(2E7-E3)(N- N-N-N-M3/M4/M5-N) , although limitations apply. Contact factory for details. Wind River VxWorks and X-ES Enterprise Linux (XEL) Board Support Packages (BSPs) are available. Features Supports Intel® Xeon® D-2800 series (formerly Eddy Lake) processors Up to 20 Xeon®-class cores in a single, power-efficient SoC package SKUs available with native extended temperature support Designed with SecureCOTS™ technology to support enhanced security and trusted computing Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash 3U VPX (VITA 46) module Compatible with multiple VITA 65 OpenVPX™ slot profiles Ruggedized Enhanced Design Implementation (REDI) per VITA 48 64 GB of DDR4 ECC SDRAM in four channels Up to 256 GB of NAND flash One 100GBASE-KR4 Ethernet port Up to two 10GBASE-KR Ethernet ports One 10/100/1000BASE-T Ethernet port Two x4 Gen3, one x4 Gen2, and two x2 Gen2 PCI Express interfaces Two USB 2.0 ports Two RS-232/422/485 serial ports RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support SOSA-aligned pinout compatible with backplane slot profile 1F1F2U1TU1T1U1T-14.2 .16 SOSA-aligned to AMPS profile MODA3-16.2.15-1-F2C- (E8)(P3F)(2E7-E3)(N- N-N-N-M3/M4/M5-N) (I/O limitations apply, contact factory for details) Wind River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Contact factory for availability of Microsoft Windows drivers and other operating systems Technical Specs Processor Intel® Xeon® D-2800 series (formerly Eddy Lake) processor Up to 20 Xeon®-class cores in a single, power-efficient SoC package SKUs available with native extended temperature support Memory 64 GB of DDR4 ECC SDRAM in four channels Up to 256 GB of NAND flash 64 MB NOR boot flash 64 kB EEPROM Security and Management Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash Designed with SecureCOTS™ technology to support enhanced security and trusted computing System voltage monitor, power-on/reset control, non-volatile write-protection control Trusted Platform Module (TPM) VPX (VITA 46) P1 I/O One 100GBASE-KR4 Ethernet port to P1.A One x4 PCI Express Gen3-capable interface to P1.B Up to two 10GBASE-KR Ethernet ports to P1.D VPX (VITA 46) P2 I/O One 10/100/1000BASE-T Ethernet port One x4 PCI Express Gen3-capable interface One x4 PCI Express Gen2-capable interface Two x2 PCI Express Gen2-capable interfaces Two USB 2.0 ports Two RS-232/422/485 serial ports Four single-ended FPGA GPIOs Software Support RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support UEFI firmware Wind River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Contact factory for availability of Microsoft Windows drivers and other operating systems Physical Characteristics 3U VPX-REDI conduction- or air-cooled form factor SOSA-aligned pinout compatible with backplane slot profile 1F1F2U1TU1T1U1T-14.2 .16 SOSA-aligned to AMPS profile MODA3-16.2.15-1-F2C- (E8)(P3F)(2E7-E3)(N- N-N-N-M3/M4/M5-N) (I/O limitations apply, contact factory for details) Dimensions: 100 mm x 160 mm 0.8 in. pitch without solder-side cover 1.0 in. pitch with Two-Level Maintenance (2LM) support Environmental Requirements Contact factory for appropriate board configuration based on environmental requirements Supported ruggedization levels (see the X-ES Ruggedization Chart): 5 Conformal coating available as an ordering option Thermal performance will vary based on CPU frequency and application Contact X-ES for air-cooled development options Power Requirements Power will vary based on configuration and usage. Please consult factory.
Description
The XPedite7871 is a secure, high-performance single board computer based on the Intel® Xeon® D-2800 series (formerly Eddy Lake) of processors, making it an optimal choice for computationally heavy applications requiring maximum data and information protection. This 3U VPX-REDI module integrates SecureCOTS™ technology with a Microsemi® PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required. The XPedite7871 provides incredible speed with one 100GBASE-KR4, up to two 10GBASE-KR, and one 10/100/1000BASE-T Ethernet ports. It accommodates up to 64 GB of DDR4 ECC SDRAM in four channels and up to 32 GB of onboard SLC NAND flash in addition to numerous I/O ports, including USB 2.0, PCIe, and RS-232/422/485 serial through the backplane connectors. The XPedite7871 offers a SOSA-aligned pinout compatible with backplane slot profile 1F1F2U1TU1T1U1T-14.2 .16. The AMPS profile is MODA3-16.2.15-1-F2C- (E8)(P3F)(2E7-E3)(N- N-N-N-M3/M4/M5-N) , although limitations apply. Contact factory for details. Wind River VxWorks and X-ES Enterprise Linux (XEL) Board Support Packages (BSPs) are available. Features Supports Intel® Xeon® D-2800 series (formerly Eddy Lake) processors Up to 20 Xeon®-class cores in a single, power-efficient SoC package SKUs available with native extended temperature support Designed with SecureCOTS™ technology to support enhanced security and trusted computing Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash 3U VPX (VITA 46) module Compatible with multiple VITA 65 OpenVPX™ slot profiles Ruggedized Enhanced Design Implementation (REDI) per VITA 48 64 GB of DDR4 ECC SDRAM in four channels Up to 256 GB of NAND flash One 100GBASE-KR4 Ethernet port Up to two 10GBASE-KR Ethernet ports One 10/100/1000BASE-T Ethernet port Two x4 Gen3, one x4 Gen2, and two x2 Gen2 PCI Express interfaces Two USB 2.0 ports Two RS-232/422/485 serial ports RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support SOSA-aligned pinout compatible with backplane slot profile 1F1F2U1TU1T1U1T-14.2 .16 SOSA-aligned to AMPS profile MODA3-16.2.15-1-F2C- (E8)(P3F)(2E7-E3)(N- N-N-N-M3/M4/M5-N) (I/O limitations apply, contact factory for details) Wind River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Contact factory for availability of Microsoft Windows drivers and other operating systems Technical Specs Processor Intel® Xeon® D-2800 series (formerly Eddy Lake) processor Up to 20 Xeon®-class cores in a single, power-efficient SoC package SKUs available with native extended temperature support Memory 64 GB of DDR4 ECC SDRAM in four channels Up to 256 GB of NAND flash 64 MB NOR boot flash 64 kB EEPROM Security and Management Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash Designed with SecureCOTS™ technology to support enhanced security and trusted computing System voltage monitor, power-on/reset control, non-volatile write-protection control Trusted Platform Module (TPM) VPX (VITA 46) P1 I/O One 100GBASE-KR4 Ethernet port to P1.A One x4 PCI Express Gen3-capable interface to P1.B Up to two 10GBASE-KR Ethernet ports to P1.D VPX (VITA 46) P2 I/O One 10/100/1000BASE-T Ethernet port One x4 PCI Express Gen3-capable interface One x4 PCI Express Gen2-capable interface Two x2 PCI Express Gen2-capable interfaces Two USB 2.0 ports Two RS-232/422/485 serial ports Four single-ended FPGA GPIOs Software Support RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support UEFI firmware Wind River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Contact factory for availability of Microsoft Windows drivers and other operating systems Physical Characteristics 3U VPX-REDI conduction- or air-cooled form factor SOSA-aligned pinout compatible with backplane slot profile 1F1F2U1TU1T1U1T-14.2 .16 SOSA-aligned to AMPS profile MODA3-16.2.15-1-F2C- (E8)(P3F)(2E7-E3)(N- N-N-N-M3/M4/M5-N) (I/O limitations apply, contact factory for details) Dimensions: 100 mm x 160 mm 0.8 in. pitch without solder-side cover 1.0 in. pitch with Two-Level Maintenance (2LM) support Environmental Requirements Contact factory for appropriate board configuration based on environmental requirements Supported ruggedization levels (see the X-ES Ruggedization Chart): 5 Conformal coating available as an ordering option Thermal performance will vary based on CPU frequency and application Contact X-ES for air-cooled development options Power Requirements Power will vary based on configuration and usage. Please consult factory.
Datasheet
Datasheet Summary
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The XPedite7871 is a 3U VPX-REDI module featuring the Intel¬Æ Xeon¬Æ D-2800 series processor, which supports up to 20 cores in a power-efficient system-on-chip (SoC) design. It is equipped with 64 GB of DDR4 ECC SDRAM and offers extensive I/O capabilities, including one 100GBASE-KR4 Ethernet port, up to two 10GBASE-KR ports, and one 10/100/1000BASE-T Ethernet port. The module also includes multiple PCI Express interfaces, USB 2.0 ports, and serial ports for versatile connectivity. Designed with SecureCOTS,Ñ¢ technology, the XPedite7871 enhances security and trusted computing, making it suitable for applications requiring stringent data protection. It incorporates a Microsemi¬Æ PolarFire,Ñ¢ SoC FPGA for custom functions and features a ruggedized design compliant with VITA standards, ensuring reliability in harsh environments. The module supports various operating systems, including Wind River VxWorks and X-ES Enterprise Linux, with additional support for Microsoft Windows drivers available upon request. The operating temperature range is from -40 to +85¬8C, making it suitable for demanding applications.

Datasheet Summary
Powered by GS/AI

The XPedite7871 is a 3U VPX-REDI module featuring the Intel¬Æ Xeon¬Æ D-2800 series processor, which supports up to 20 cores in a power-efficient system-on-chip (SoC) design. It is equipped with 64 GB of DDR4 ECC SDRAM and offers extensive I/O capabilities, including one 100GBASE-KR4 Ethernet port, up to two 10GBASE-KR ports, and one 10/100/1000BASE-T Ethernet port. The module also includes multiple PCI Express interfaces, USB 2.0 ports, and serial ports for versatile connectivity. Designed with SecureCOTS,Ñ¢ technology, the XPedite7871 enhances security and trusted computing, making it suitable for applications requiring stringent data protection. It incorporates a Microsemi¬Æ PolarFire,Ñ¢ SoC FPGA for custom functions and features a ruggedized design compliant with VITA standards, ensuring reliability in harsh environments. The module supports various operating systems, including Wind River VxWorks and X-ES Enterprise Linux, with additional support for Microsoft Windows drivers available upon request. The operating temperature range is from -40 to +85¬8C, making it suitable for demanding applications.

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Intel® Xeon® D-2800 Processor-Based 3U VPX-REDI Module with 64 GB of DDR4, 100 Gigabit Ethernet, and SecureCOTS™ - XPedite7871 - Extreme Engineering Solutions, Inc. (X-ES)
Verona, WI, United States
Intel® Xeon® D-2800 Processor-Based 3U VPX-REDI Module with 64 GB of DDR4, 100 Gigabit Ethernet, and SecureCOTS™
XPedite7871
Intel® Xeon® D-2800 Processor-Based 3U VPX-REDI Module with 64 GB of DDR4, 100 Gigabit Ethernet, and SecureCOTS™ XPedite7871
The XPedite7871 is a secure, high-performance single board computer based on the Intel® Xeon® D-2800 series (formerly Eddy Lake) of processors, making it an optimal choice for computationally heavy applications requiring maximum data and information protection. This 3U VPX-REDI module integrates SecureCOTS™ technology with a Microsemi® PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required. The XPedite7871 provides incredible speed with one 100GBASE-KR4, up to two 10GBASE-KR, and one 10/100/1000BASE-T Ethernet ports. It accommodates up to 64 GB of DDR4 ECC SDRAM in four channels and up to 32 GB of onboard SLC NAND flash in addition to numerous I/O ports, including USB 2.0, PCIe, and RS-232/422/485 serial through the backplane connectors. The XPedite7871 offers a SOSA-aligned pinout compatible with backplane slot profile 1F1F2U1TU1T1U1T-14.2 .16. The AMPS profile is MODA3-16.2.15-1-F2C- (E8)(P3F)(2E7-E3)(N- N-N-N-M3/M4/M5-N) , although limitations apply. Contact factory for details. Wind River VxWorks and X-ES Enterprise Linux (XEL) Board Support Packages (BSPs) are available. Features Supports Intel® Xeon® D-2800 series (formerly Eddy Lake) processors Up to 20 Xeon®-class cores in a single, power-efficient SoC package SKUs available with native extended temperature support Designed with SecureCOTS™ technology to support enhanced security and trusted computing Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash 3U VPX (VITA 46) module Compatible with multiple VITA 65 OpenVPX™ slot profiles Ruggedized Enhanced Design Implementation (REDI) per VITA 48 64 GB of DDR4 ECC SDRAM in four channels Up to 256 GB of NAND flash One 100GBASE-KR4 Ethernet port Up to two 10GBASE-KR Ethernet ports One 10/100/1000BASE-T Ethernet port Two x4 Gen3, one x4 Gen2, and two x2 Gen2 PCI Express interfaces Two USB 2.0 ports Two RS-232/422/485 serial ports RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support SOSA-aligned pinout compatible with backplane slot profile 1F1F2U1TU1T1U1T-14.2 .16 SOSA-aligned to AMPS profile MODA3-16.2.15-1-F2C- (E8)(P3F)(2E7-E3)(N- N-N-N-M3/M4/M5-N) (I/O limitations apply, contact factory for details) Wind River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Contact factory for availability of Microsoft Windows drivers and other operating systems Technical Specs Processor Intel® Xeon® D-2800 series (formerly Eddy Lake) processor Up to 20 Xeon®-class cores in a single, power-efficient SoC package SKUs available with native extended temperature support Memory 64 GB of DDR4 ECC SDRAM in four channels Up to 256 GB of NAND flash 64 MB NOR boot flash 64 kB EEPROM Security and Management Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash Designed with SecureCOTS™ technology to support enhanced security and trusted computing System voltage monitor, power-on/reset control, non-volatile write-protection control Trusted Platform Module (TPM) VPX (VITA 46) P1 I/O One 100GBASE-KR4 Ethernet port to P1.A One x4 PCI Express Gen3-capable interface to P1.B Up to two 10GBASE-KR Ethernet ports to P1.D VPX (VITA 46) P2 I/O One 10/100/1000BASE-T Ethernet port One x4 PCI Express Gen3-capable interface One x4 PCI Express Gen2-capable interface Two x2 PCI Express Gen2-capable interfaces Two USB 2.0 ports Two RS-232/422/485 serial ports Four single-ended FPGA GPIOs Software Support RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support UEFI firmware Wind River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Contact factory for availability of Microsoft Windows drivers and other operating systems Physical Characteristics 3U VPX-REDI conduction- or air-cooled form factor SOSA-aligned pinout compatible with backplane slot profile 1F1F2U1TU1T1U1T-14.2 .16 SOSA-aligned to AMPS profile MODA3-16.2.15-1-F2C- (E8)(P3F)(2E7-E3)(N- N-N-N-M3/M4/M5-N) (I/O limitations apply, contact factory for details) Dimensions: 100 mm x 160 mm 0.8 in. pitch without solder-side cover 1.0 in. pitch with Two-Level Maintenance (2LM) support Environmental Requirements Contact factory for appropriate board configuration based on environmental requirements Supported ruggedization levels (see the X-ES Ruggedization Chart): 5 Conformal coating available as an ordering option Thermal performance will vary based on CPU frequency and application Contact X-ES for air-cooled development options Power Requirements Power will vary based on configuration and usage. Please consult factory.

The XPedite7871 is a secure, high-performance single board computer based on the Intel® Xeon® D-2800 series (formerly Eddy Lake) of processors, making it an optimal choice for computationally heavy applications requiring maximum data and information protection.

This 3U VPX-REDI module integrates SecureCOTS™ technology with a Microsemi® PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.

The XPedite7871 provides incredible speed with one 100GBASE-KR4, up to two 10GBASE-KR, and one 10/100/1000BASE-T Ethernet ports. It accommodates up to 64 GB of DDR4 ECC SDRAM in four channels and up to 32 GB of onboard SLC NAND flash in addition to numerous I/O ports, including USB 2.0, PCIe, and RS-232/422/485 serial through the backplane connectors.

The XPedite7871 offers a SOSA-aligned pinout compatible with backplane slot profile 1F1F2U1TU1T1U1T-14.2.16. The AMPS profile is MODA3-16.2.15-1-F2C-(E8)(P3F)(2E7-E3)(N-N-N-N-M3/M4/M5-N)<N>, although limitations apply. Contact factory for details.

Wind River VxWorks and X-ES Enterprise Linux (XEL) Board Support Packages (BSPs) are available.


Features

  • Supports Intel® Xeon® D-2800 series (formerly Eddy Lake) processors
  • Up to 20 Xeon®-class cores in a single, power-efficient SoC package
  • SKUs available with native extended temperature support
  • Designed with SecureCOTS™ technology to support enhanced security and trusted computing
  • Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash
  • 3U VPX (VITA 46) module
  • Compatible with multiple VITA 65 OpenVPX™ slot profiles
  • Ruggedized Enhanced Design Implementation (REDI) per VITA 48
  • 64 GB of DDR4 ECC SDRAM in four channels
  • Up to 256 GB of NAND flash
  • One 100GBASE-KR4 Ethernet port
  • Up to two 10GBASE-KR Ethernet ports
  • One 10/100/1000BASE-T Ethernet port
  • Two x4 Gen3, one x4 Gen2, and two x2 Gen2 PCI Express interfaces
  • Two USB 2.0 ports
  • Two RS-232/422/485 serial ports
  • RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support
  • SOSA-aligned pinout compatible with backplane slot profile 1F1F2U1TU1T1U1T-14.2.16
  • SOSA-aligned to AMPS profile MODA3-16.2.15-1-F2C-(E8)(P3F)(2E7-E3)(N-N-N-N-M3/M4/M5-N)<N> (I/O limitations apply, contact factory for details)
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Contact factory for availability of Microsoft Windows drivers and other operating systems

Technical Specs

Processor

  • Intel® Xeon® D-2800 series (formerly Eddy Lake) processor
  • Up to 20 Xeon®-class cores in a single, power-efficient SoC package
  • SKUs available with native extended temperature support

Memory

  • 64 GB of DDR4 ECC SDRAM in four channels
  • Up to 256 GB of NAND flash
  • 64 MB NOR boot flash
  • 64 kB EEPROM

Security and Management

  • Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash
  • Designed with SecureCOTS™ technology to support enhanced security and trusted computing
  • System voltage monitor, power-on/reset control, non-volatile write-protection control
  • Trusted Platform Module (TPM)

VPX (VITA 46) P1 I/O

  • One 100GBASE-KR4 Ethernet port to P1.A
  • One x4 PCI Express Gen3-capable interface to P1.B
  • Up to two 10GBASE-KR Ethernet ports to P1.D

VPX (VITA 46) P2 I/O

  • One 10/100/1000BASE-T Ethernet port
  • One x4 PCI Express Gen3-capable interface
  • One x4 PCI Express Gen2-capable interface
  • Two x2 PCI Express Gen2-capable interfaces
  • Two USB 2.0 ports
  • Two RS-232/422/485 serial ports
  • Four single-ended FPGA GPIOs

Software Support

  • RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support
  • UEFI firmware
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Contact factory for availability of Microsoft Windows drivers and other operating systems

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • SOSA-aligned pinout compatible with backplane slot profile 1F1F2U1TU1T1U1T-14.2.16
  • SOSA-aligned to AMPS profile MODA3-16.2.15-1-F2C-(E8)(P3F)(2E7-E3)(N-N-N-N-M3/M4/M5-N)<N> (I/O limitations apply, contact factory for details)
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 1.0 in. pitch with Two-Level Maintenance (2LM) support

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
  • Conformal coating available as an ordering option
  • Thermal performance will vary based on CPU frequency and application
  • Contact X-ES for air-cooled development options

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.
Supplier's Site Datasheet

Technical Specifications

  Extreme Engineering Solutions, Inc. (X-ES)
Product Category Single Board Computers (SBC)
Product Number XPedite7871
Product Name Intel® Xeon® D-2800 Processor-Based 3U VPX-REDI Module with 64 GB of DDR4, 100 Gigabit Ethernet, and SecureCOTS™
Processor / CPU Intel® Xeon®
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