Extreme Engineering Solutions, Inc. (X-ES) Intel® Xeon® D-1700 Processor-Based Rugged COM Express® Basic (Type 7) Module with Quad 10 Gigabit Ethernet XPedite7750

The XPedite7750 is an enhanced, Type 7 COM Express® module based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors. COM Express® provides a standards-based form factor to bring PC processing to a wide range of applications. The XPedite7750 is ideal for the high-bandwidth and processing-intensive requirements of today’s commercial, industrial, and military applications. The small footprint and standards-based form factor make the XPedite7750 perfect for portable and rugged environments, while providing an upgrade path for the future. This module integrates SecureCOTS™ technology with a Microsemi® PolarFire™ FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required. The XPedite7750 accommodates 32 GB of DDR4 ECC SDRAM in two channels to support memory-intensive applications. The XPedite7750 also hosts numerous I/O ports and interfaces, including 10 Gigabit Ethernet, Gigabit Ethernet, PCI Express, USB 3.0, and LVTTL serial. Wind River VxWorks and X-ES Enterprise Linux Support Packages (XEL) are available. Features Supports Intel® Xeon® D-1700 series (formerly Ice Lake-D) processors Up to 10 Xeon®-class cores in a single, power-efficient SoC package SKUs available with native extended temperature support Designed with SecureCOTS™ technology to support enhanced security and trusted computing Microsemi® PolarFire™ FPGA with 128 MB SPI flash Standard COM Express® Basic form factor with ruggedization enhancements COM Express® enhanced Type 7 pinout 32 GB of DDR4 ECC SDRAM in two channels 32 GB of SLC NAND flash 16 lanes of PCIe Gen3, available as one x16 PCIe interface 16 lanes of PCIe Gen2, available as two x8 PCIe interfaces Four 10GBASE-KR Ethernet ports (can be configured as one 40GBASE-KR4 Ethernet port) One 10/100/1000BASE-T Ethernet port Four USB 3.0 ports Two LVTTL serial ports Wind River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Contact factory for availability of Microsoft Windows drivers and other operating systems Technical Specs Processor Intel® Xeon® D-1700 series (formerly Ice Lake-D) processors Up to 10 Xeon®-class cores in a single, power-efficient SoC package SKUs available with native extended temperature support Memory 32 GB of DDR4 ECC SDRAM in two channels 32 GB of SLC NAND flash 32 MB NOR boot flash 64 kB EEPROM Security and Management Microsemi® PolarFire™ FPGA with 128 MB SPI flash Designed with SecureCOTS™ technology to support enhanced security and trusted computing System voltage monitor, power-on/reset control, non-volatile write-protection control Trusted Platform Module (TPM) COM Express® Basic form factor (95 mm x 125 mm) Enhanced Type 7 pinout Adds non-volatile write protect Adds two external interrupts Adds boot flash select Interface Four USB 3.0 ports Four 10GBASE-KR Ethernet ports with optional management sideband signals (availability dependent on firmware and drivers); can be configured as one 40GBASE-KR4 Ethernet port One 10/100/1000BASE-T Ethernet port One x16 PCI Express Gen3-capable interface Two x8 PCI Express Gen2-capable interfaces Two LVTTL serial ports Four GPI and four GPO pins Software Support Wind River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Contact factory for availability of Microsoft Windows drivers and other operating systems Ruggedization and Reliability Class III PCB fabrication and assembly Soldered DDR4 ECC SDRAM Tin whisker mitigation Designed and tested for extended solder joint reliability Additional mounting holes for rugged and conduction-cooled environments BIT support Physical Characteristics COM Express® Basic (Type 7) form factor Dimensions: 95 mm x 125 mm Environmental Requirements Contact factory for appropriate board configuration based on environmental requirements Supported ruggedization levels (see the X-ES Ruggedization Chart): 5 Conformal coating available as an ordering option Contact X-ES for air-cooled development options Power Requirements Power will vary based on configuration and usage. Please consult factory.