Extreme Engineering Solutions, Inc. (X-ES) Intel® Xeon® D-1500 Family Processor-Based 3U VPX-REDI Module with Dual 10 Gigabit Ethernet and XMC Site XPedite7680

The XPedite7680 is a high-performance, 3U VPX-REDI, single board computer based on the Intel® Xeon® D-1500 family processors (formerly Broadwell-DE). The Intel® Xeon® D processor can provide up to 16 Xeon®-class cores in a single, power-efficient System-on-Chip (SoC) package. The XPedite7680 maximizes network performance with two 10GBASE-KR Ethernet ports and one 10/100/1000BASE-T Ethernet port. Up to eight PCI Express Gen3 lanes are routed to the backplane P1 connector, supporting a single x8 PCIe interface or two x4 PCIe interfaces. This interface also supports Non-Transparent Bridging, enabling direct communication with other Intel® processors, and there is no need for a separate switch module in the system, further reducing SWaP-C for the system integrator. The XPedite7680 provides superior growth and expansion capabilities through an XMC site, while maintaining a 0.8 in. VPX slot pitch (12-core processor configurations require 1.0 in. pitch). This gives system integrators a plethora of COTS options for additional I/O, storage, or processing. The XPedite7680 has orderable options supporting a SOSA-aligned pinout compatible with backplane slot profile 1F1F2U1TU1T1U1T-14.2 .16. The XPedite7680 accommodates up to 32 GB of DDR4 ECC SDRAM in two channels to support memory-intensive applications. The XPedite7680 also hosts numerous I/O ports, including USB, SATA, and RS-232/422/485 serial through the backplane connectors. Wind River VxWorks and X-ES Enterprise Linux Support Packages (XEL) are available. Features Supports Intel® Xeon® D-1500 family processors (formerly Broadwell-DE) Up to 16 Xeon®-class cores in a single, power-efficient SoC package 4, 8, or 12 core SKUs available with native extended temperature support 3U VPX (VITA 46) module Optional VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC) Compatible with multiple VITA 65 OpenVPX™ slot profiles (SOSA-aligned configurations available) Ruggedized Enhanced Design Implementation (REDI) per VITA 48 Conduction- or air-cooled Up to 32 GB of DDR4 ECC SDRAM in two channels Up to 128 GB of SLC NAND flash XMC interface with a x8 PCIe interface and rear I/O support One x8 or two x4 PCI Express backplane fabric interconnects Two 10GBASE-KR Ethernet ports One 10/100/1000BASE-T Ethernet port Two USB 2.0 ports One RS-232/422/485 serial port Two SATA ports SOSA-aligned pinout compatible with backplane slot profile 1F1F2U1TU1T1U1T-14.2 .16 Wind River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Contact factory for availability of Microsoft Windows drivers and other operating systems Technical Specs Processor Intel® Xeon® D-1500 family processors (formerly Broadwell-DE) Up to 16 Xeon®-class cores in a single, power-efficient SoC package 4, 8, or 12 core SKUs available with native extended temperature support Memory Up to 32 GB of DDR4 ECC SDRAM in two channels Up to 128 GB of SLC NAND flash 32 MB NOR boot flash 64 kB EEPROM VPX (VITA 46) P0 I/O VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC) 1 Pulse Per Second (1PPS) VPX (VITA 46) P1 I/O x4 PCI Express Gen3-capable interface to P1.A x4 PCI Express Gen3-capable interface to P1.B Two 10GBASE-KR Ethernet ports XMC P16 I/O, mapping P1w9-X12d per VITA 46.9 3.3 V GPIO signals VPX (VITA 46) P2 I/O One 10/100/1000BASE-T Gigabit Ethernet port Two SATA ports capable of 6 Gb/s Two USB 2.0 ports One RS-232/422/485 serial port XMC Site x8 PCI Express Gen3-capable interface X12d P16 I/O Additional Features Non-volatile memory write protection Trusted Platform Module (TPM 2.0) IEEE 1588 support on one Gigabit Ethernet port Software Support Wind River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Contact factory for availability of Microsoft Windows drivers and other operating systems Physical Characteristics 3U VPX-REDI conduction- or air-cooled form factor SOSA-aligned pinout compatible with backplane slot profile 1F1F2U1TU1T1U1T-14.2 .16 Dimensions: 100 mm x 160 mm 0.8 in. pitch without solder-side cover (optional) 1.0 in. pitch with Two-Level Maintenance (2LM) support Environmental Requirements Contact factory for appropriate board configuration based on environmental requirements. Supported ruggedization levels (see the X-ES Ruggedization Chart): 5 Conformal coating available as an ordering option Contact X-ES for air-cooled development options Power Requirements Power will vary based on configuration and usage. Please consult factory.