LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies. High reliability and a wide reflow process window are at the foundation of this material, ensuring its outstanding performance for the most demanding high value PCB applications.
LOCTITE HF 212 is a halogen-free, no clean, low voiding Pb-free solder paste. Is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC. Suitable for high speed printing up to 150 mm/s. Solderable on challenging surface finishes (CuNiZn and Copper OSP). Colorless residues for easy post-reflow inspection. RS 832-9750: HF 212 solder paste 97SC DAP. RS 832-9769: HF 212 solder paste 90iSC DAP. RS 832-9762: HF 212 solder paste 90iSC AGS. RS 832-9766: HF 212 solder paste 97SC AGS. RS 832-9775: HF 212 solder paste SAC0307 AGS
Trade Name = Loctite HF212 SAC0307 AGS
Lead Free = Yes
Package Type = Jar
Package Size = 500g
| RS Components, Ltd. | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | 8329775 |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
