ECS Inc. International Through Hole Crystals ECS-100-18-9X

Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
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Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
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Datasheet
Datasheet Summary
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The ECS-3X9X is a miniature high-frequency quartz crystal for frequencies from 4.00 to 70.00 MHz, designed for applications requiring high reliability and environmental stability. It is available in a 3x9 mm package, operates from -10 to +60°C, and has a load capacitance of 16 pF (customer-specified). Frequency tolerance is ±50 ppm at +25°C, with stability of ±50 ppm across the operating temperature range. The crystal operates in fundamental mode up to 30.00 MHz and third overtone above, with maximum ESR values of 50 Ω to 100 Ω depending on frequency. Drive level is 50 to 100 μW, insulation resistance is 500 MΩ minimum, and aging is ±5 ppm maximum over the first year. The device is RoHS compliant and features a solder profile peak of +260°C for 10 seconds max with MSL 1 rating.

Datasheet Summary
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The ECS-3X9X is a miniature high-frequency quartz crystal for frequencies from 4.00 to 70.00 MHz, designed for applications requiring high reliability and environmental stability. It is available in a 3x9 mm package, operates from -10 to +60°C, and has a load capacitance of 16 pF (customer-specified). Frequency tolerance is ±50 ppm at +25°C, with stability of ±50 ppm across the operating temperature range. The crystal operates in fundamental mode up to 30.00 MHz and third overtone above, with maximum ESR values of 50 Ω to 100 Ω depending on frequency. Drive level is 50 to 100 μW, insulation resistance is 500 MΩ minimum, and aging is ±5 ppm maximum over the first year. The device is RoHS compliant and features a solder profile peak of +260°C for 10 seconds max with MSL 1 rating.

Suppliers

Company
Product
Description
Supplier Links
Through Hole Crystals - ECS-100-18-9X - ECS Inc. International
Lenexa, KS, United States
Through Hole Crystals
ECS-100-18-9X
Through Hole Crystals ECS-100-18-9X
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications.

Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors.

Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Supplier's Site Datasheet
Crystals - XC1378-ND - DigiKey
Thief River Falls, MN, United States
Crystals
XC1378-ND
Crystals XC1378-ND
10MHz ±50ppm Crystal 18pF 50 Ohms Cylindrical Can, Radial

10MHz ±50ppm Crystal 18pF 50 Ohms Cylindrical Can, Radial

Buy Now Datasheet
CRYSTAL 10.0000MHZ 18PF TH

CRYSTAL 10.0000MHZ 18PF TH

Supplier's Site

Technical Specifications

  ECS Inc. International DigiKey Shenzhen Shengyu Electronics Technology Limited
Product Category Crystals Crystals Crystals
Product Number ECS-100-18-9X XC1378-ND ECS-100-18-9X
Product Name Through Hole Crystals Crystals Crystals
Package / Form Factor Through Hole Crystals Through Hole; Cylindrical Can, Radial Through Hole
Features / Standards RoHS Lead-Free
Frequency 10 MHz 10 MHz
Frequency Stability 50 ppm 50 ppm
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