Dymax Dymax Multi-Cure 6-621-T UV Curing Adhesive Clear 10 mL MR Syringe 6-621-T/10SYMR

Description
Dymax Multi-Cure 6-621-T UV Curing Adhesive Clear is used for rapid assembling of parts made of metal, glass, ceramic, phenolic, filled polyamide, and other materials. It offers secondary heat cure, hard and clear bonds, and activator cure. 10 mL MR Syringe.
Request a Quote Datasheet
Description
Dymax Multi-Cure 6-621-T UV Curing Adhesive Clear is used for rapid assembling of parts made of metal, glass, ceramic, phenolic, filled polyamide, and other materials. It offers secondary heat cure, hard and clear bonds, and activator cure. 10 mL MR Syringe.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Dymax Multi-Cure 6-621-T UV Curing Adhesive Clear 10 mL MR Syringe - 6-621-T 10ML MR SYRINGE - Ellsworth Adhesives
Germantown, WI, USA
Dymax Multi-Cure 6-621-T UV Curing Adhesive Clear 10 mL MR Syringe
6-621-T 10ML MR SYRINGE
Dymax Multi-Cure 6-621-T UV Curing Adhesive Clear 10 mL MR Syringe 6-621-T 10ML MR SYRINGE
Dymax Multi-Cure 6-621-T UV Curing Adhesive Clear is used for rapid assembling of parts made of metal, glass, ceramic, phenolic, filled polyamide, and other materials. It offers secondary heat cure, hard and clear bonds, and activator cure. 10 mL MR Syringe.

Dymax Multi-Cure 6-621-T UV Curing Adhesive Clear is used for rapid assembling of parts made of metal, glass, ceramic, phenolic, filled polyamide, and other materials. It offers secondary heat cure, hard and clear bonds, and activator cure. 10 mL MR Syringe.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number 6-621-T 10ML MR SYRINGE
Product Name Dymax Multi-Cure 6-621-T UV Curing Adhesive Clear 10 mL MR Syringe
Cure / Technology Single Component
Unlock Full Specs
to access all available technical data

Similar Products

Silicone-Free Thermal Gel Series - AE30-LT - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Chemical System Silicone
Type / Form Gel
Features Thermally Conductive
View Details
Adhesives -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Cure / Technology Two Component  
Chemical System Epoxy; Silicone
View Details
Fiber Adhesive -  - Beijing Grish Hitech Co., Ltd.
Beijing Grish Hitech Co., Ltd.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Type / Form Liquid
View Details
Light-Curable Materials, Dissimilar Substrate Bonding, 9-20801 -  - Dymax
Specs
Cure / Technology UV or Radiation Cured
Substrate Compatibility Ceramic, Glass; Rubber or Elastomer; Dissimilar Substrates; PCB; Ceramic; Lead Frame; Silicon; FR4; Metal
Viscosity 110000 cP
View Details