Artesyn Embedded Power AdvancedTCA Platform Core Centellis 2100

Description
The Artesyn Embedded Technologies Centellis® 2100 platform core is a high availability platform ideally suited for data intensive, central office and enterprise networking applications. The low profile makes the Centellis 2100 the optimal candidate for distributed networking functions, low density subscriber areas, or specialized applications. Target applications include security and DPI applicances, distributed control plane functions, IMS/IPTV subsystems, 4G wireless applications, and edge networking and routing. With power and cooling support for up to 400 W per slot and up to 500 W in a single slot configuration, the new Centellis 2100 enables systems integrators to increase performance and I/O bandwidth per slot, while preparing for future performance upgrades that will have increasing power and cooling requirements. Designed to meet NEBS and ETSI environmental requirements, the Centellis 2100 features front-to-rear cooling, and is designed to meet and exceed the stringent Communications Platform Trade Association (CP-TA) B.4 thermal profile.
Datasheet
Description
The Artesyn Embedded Technologies Centellis® 2100 platform core is a high availability platform ideally suited for data intensive, central office and enterprise networking applications. The low profile makes the Centellis 2100 the optimal candidate for distributed networking functions, low density subscriber areas, or specialized applications. Target applications include security and DPI applicances, distributed control plane functions, IMS/IPTV subsystems, 4G wireless applications, and edge networking and routing. With power and cooling support for up to 400 W per slot and up to 500 W in a single slot configuration, the new Centellis 2100 enables systems integrators to increase performance and I/O bandwidth per slot, while preparing for future performance upgrades that will have increasing power and cooling requirements. Designed to meet NEBS and ETSI environmental requirements, the Centellis 2100 features front-to-rear cooling, and is designed to meet and exceed the stringent Communications Platform Trade Association (CP-TA) B.4 thermal profile.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
AdvancedTCA Platform Core - Centellis 2100 - Artesyn Embedded Power
Tempe, AZ, USA
AdvancedTCA Platform Core
Centellis 2100
AdvancedTCA Platform Core Centellis 2100
The Artesyn Embedded Technologies Centellis® 2100 platform core is a high availability platform ideally suited for data intensive, central office and enterprise networking applications. The low profile makes the Centellis 2100 the optimal candidate for distributed networking functions, low density subscriber areas, or specialized applications. Target applications include security and DPI applicances, distributed control plane functions, IMS/IPTV subsystems, 4G wireless applications, and edge networking and routing. With power and cooling support for up to 400 W per slot and up to 500 W in a single slot configuration, the new Centellis 2100 enables systems integrators to increase performance and I/O bandwidth per slot, while preparing for future performance upgrades that will have increasing power and cooling requirements. Designed to meet NEBS and ETSI environmental requirements, the Centellis 2100 features front-to-rear cooling, and is designed to meet and exceed the stringent Communications Platform Trade Association (CP-TA) B.4 thermal profile.

The Artesyn Embedded Technologies Centellis® 2100 platform core is a high availability platform ideally suited for data intensive, central office and enterprise networking applications. The low profile makes the Centellis 2100 the optimal candidate for distributed networking functions, low density subscriber areas, or specialized applications. Target applications include security and DPI applicances, distributed control plane functions, IMS/IPTV subsystems, 4G wireless applications, and edge networking and routing.

With power and cooling support for up to 400 W per slot and up to 500 W in a single slot configuration, the new Centellis 2100 enables systems integrators to increase performance and I/O bandwidth per slot, while preparing for future performance upgrades that will have increasing power and cooling requirements. Designed to meet NEBS and ETSI environmental requirements, the Centellis 2100 features front-to-rear cooling, and is designed to meet and exceed the stringent Communications Platform Trade Association (CP-TA) B.4 thermal profile.

Supplier's Site Datasheet

Technical Specifications

  Artesyn Embedded Power
Product Category AdvancedTCA Products
Product Number Centellis 2100
Product Name AdvancedTCA Platform Core
Form Factor AdvancedTCA
Product Type Chassis / System Platform
Slots 2
GbE ports 3 #
Operating System Linux
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