MacDermid Alpha Electronics Solutions Panel Level Packaging Metallization Solutions Systek ™ BAF Ni

Product Overview Systek™ BAF Ni is an easy to control nickel barrier layer electroplating process. It delivers pure, ductile, fine-grained, low stress nickel deposits with excellent coplanarity, meeting the requirements of next-generation semiconductor packages. Part of our Panel Level Packaging (PLP) Portfolio, the chemistry contains no boric acid, in compliance with specific regulatory needs. It meets the exacting performance and manufacturing requirements of advanced packaging architectures. Systek BAF Ni is an effective barrier metal, limiting conversion of solder to intermetallic compounds (IMC), resulting in no void formation at the interface. With excellent via filling capability, the chemistry delivers a smooth surface at lower operating temperatures, enhancing cost of ownership. Product Features Sustainability and Regulatory Compliance Boric acid-free for compliance with Substances of Very High Concern (SVCH) and Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) regulations, enabling manufacturers to meet their environmental goals. Compatibility with high-purity semiconductor environments Meets the exacting performance and manufacturing requirements associated with wafer plating. Tunable process control for uniform coatings with predictable stress Film stress can be tuned via temperature control and BAF Ni-A concentration. Bump and Pillar Plating Systek BAF Ni exhibits a smooth deposit surface and uniform bump shape, comparable to a traditional nickel-plating process.