MacDermid Alpha Electronics Solutions PC 610

Pulse plating process with excellent control of throwing power within through-holes, surface copper thickness and variation. Product Overview PC 610 is an industry-leading pulse plating process designed to provide excellent throwing power within through-holes, surface copper thickness, and surface copper variation. The process enhances the reliability of planarization and etching processes. PC 610 can significantly reduce plating times while providing an excellent surface-to-hole plating thickness ratio. Superior Throwing Power PC 610 offers excellent throwing power on through-holes with aspect ratios exceeding 30:1. Excellent Surface Copper Thickness Used for plating high aspect ratio through-holes and microvias by panel, pattern, and button plating. Increased Reliability Produces consistently excellent electrolytic copper deposits with high tensile strength and elongation over a long bath life.