MacDermid Alpha Electronics Solutions PC 600

Description
Pulse plating process that delivers precise thickness uniformity and productivity unattainable by conventional acid copper plating. Product Overview PC 600 is an industry-leading pulse plating process trusted by fabricators worldwide for achieving precise thickness uniformity and productivity levels beyond the capabilities of conventional acid copper plating. It is specifically designed for the metallization of high technology panels with through hole aspect ratios approaching 30:1. The process delivers excellent thickness uniformity, reliable thermal cycle performance, and superior throwing power into both through holes and blind vias.
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Description
Pulse plating process that delivers precise thickness uniformity and productivity unattainable by conventional acid copper plating. Product Overview PC 600 is an industry-leading pulse plating process trusted by fabricators worldwide for achieving precise thickness uniformity and productivity levels beyond the capabilities of conventional acid copper plating. It is specifically designed for the metallization of high technology panels with through hole aspect ratios approaching 30:1. The process delivers excellent thickness uniformity, reliable thermal cycle performance, and superior throwing power into both through holes and blind vias.
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Suppliers

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Product
Description
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PC 600 -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
PC 600
PC 600
Pulse plating process that delivers precise thickness uniformity and productivity unattainable by conventional acid copper plating. Product Overview PC 600 is an industry-leading pulse plating process trusted by fabricators worldwide for achieving precise thickness uniformity and productivity levels beyond the capabilities of conventional acid copper plating. It is specifically designed for the metallization of high technology panels with through hole aspect ratios approaching 30:1. The process delivers excellent thickness uniformity, reliable thermal cycle performance, and superior throwing power into both through holes and blind vias.

Pulse plating process that delivers precise thickness uniformity and productivity unattainable by conventional acid copper plating.

Product Overview

PC 600 is an industry-leading pulse plating process trusted by fabricators worldwide for achieving precise thickness uniformity and productivity levels beyond the capabilities of conventional acid copper plating. It is specifically designed for the metallization of high technology panels with through hole aspect ratios approaching 30:1.

The process delivers excellent thickness uniformity, reliable thermal cycle performance, and superior throwing power into both through holes and blind vias.

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Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Name PC 600
Chemical / Composition Copper Plating
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