MacDermid Alpha Electronics Solutions MICROFAB ® AU310-T

MICROFAB AU310-T enables an arsenic free bright plating solution with superior surface roughness for fine pitch pattern gold bumping. Product Overview MICROFAB AU310-T is a mild alkaline non-cyanide, gold electroplating process that produces deposits of 99.99% purity. MICROFAB AU310-T is frequently used in bump plating on metalized silicon wafers Features High purity – soft gold Columnar Superior surface roughness Uniform post gold seed etch Lead-free Arsenic-free Cyanide-free