High-speed copper plating process for copper pillars in flip chip packages, copper microbumps in 3D interconnects, and RDL.
Product Overview
The MICROFAB SC acid copper plating process is designed for copper pillars in flip chip packages, copper microbumps, and redistribution layers. It delivers accurate bump height uniformity and shape control. This formulation offers excellent throwing power, improved leveling characteristics, and ductile, low-stress deposits.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | MICROFAB ® SC |
