MacDermid Alpha Electronics Solutions MacuSpec ™ PPR 100 & 200

Pulse plating processes that enable precise thickness uniformity, reliable thermal cycle performance, and superior throwing power. Product Overview MacuSpec PPR 100 and 200 are industry-leading pulse plating processes trusted by fabricators worldwide who demand precise thickness uniformity and overall productivity that conventional acid copper plating cannot achieve. These processes are designed for the metallization of high-tech panels with through-hole aspect ratios approaching 30:1. Exceptional Thickness Uniformity Uniform copper distribution allows for a reduction in dry film thickness, resulting in lower operating costs. Reliable Thermal Cycle Performance Increased thermal cycling performance for enhanced reliability in today’s multilayer PCBs. Superior Throwing Power The processes provide superior throwing power into high-aspect ratio through-holes, reducing plating time by up to 70%.