High-speed copper plating process provides exceptional within-die and within-feature uniformity for mega pillar applications.
Product Overview
MICROFAB MP-2500 is a high-speed copper plating process engineered for mega pillar applications, delivering exceptional within-die (WID) and within-feature (WIF, TIR) uniformity.
Excellent Uniformity for Thermal Pillar Applications
MICROFAB MP-2500 achieves high-speed plating rates, delivering high-purity bumps with excellent coplanarity for enhanced reliability.
Increased Throughput and Yields
MICROFAB MP-2500 enables high throughput, a flat bump shape, and low Kirkendall void (KV) capability.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | MICROFAB ® MP-2500 |
