MacDermid Alpha Electronics Solutions MICROFAB ® MP-2500

As Wafer Level Packing technology continues to expand, MacDermid Alpha is growing it’s WLP portfolio of innovation driven by heterogeneous packages. MICROFAB MP-2500 allows interconnection of 2.5D and 3D wafer level fan-out and PoP technology that need thermal management for high performance and high reliability. Product Overview MICROFAB MP-2500 is a high-speed copper plating process engineered for mega pillar applications. It provides exceptional within-die (WID) and within-feature (WIF, TIR) uniformity. 220um tall dense Feature – TIR = 0 um 220um tall ISO Feature – TIR = 0 um Features High speed High purity Flat bump shape Thermal pillar Excellent coplanarity