- Trained on our vast library of engineering resources.

MacDermid Alpha Electronics Solutions ENTEK PLUS IC

Description
Organic Solderability Preservative (OSP) for Integrated Circuit (IC) substrate applications. Product Overview The ENTEK Organic Solderability Preservative (OSP) brand is the industry’s most trusted and widely used on the market today! ENTEK PLUS IC is the latest addition to the ENTEK OSP family, providing performance and yield improvement for substrate manufacturers. ENTEK PLUS IC’s industry leading thickness capability allows unrivalled shelf life of 24 months, providing supply chain flexibility and performance risk elimination associated with other OSP’s. With proven resistance to de-flux materials, ENTEK PLUS IC OSP maintains thickness through cleaning operations, delivering reliable performance for subsequent assembly operations ensuring yield maximization. ENTEK PLUS IC OSP forms a copper-tin intermetallic producing the strongest possible solder joint. Working in collaboration with Alpha Assembly ENTEK PLUS IC’s interaction with assembly materials has been optimized and verified through extensive solder-spread, ball-shear and drop shock testing. Product Features Industry leading OSP coating thickness capability. 24-month shelf life under best practice packaging and storage. Visually unchanged retaining performance after multiple N2 reflows. Significant minimization of OSP thickness reduction through de-flux providing protection of copper surfaces for further assembly. Optimized interaction with assembly materials for BGA ball attach technologies.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
ENTEK PLUS IC -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
ENTEK PLUS IC
ENTEK PLUS IC
Organic Solderability Preservative (OSP) for Integrated Circuit (IC) substrate applications. Product Overview The ENTEK Organic Solderability Preservative (OSP) brand is the industry’s most trusted and widely used on the market today! ENTEK PLUS IC is the latest addition to the ENTEK OSP family, providing performance and yield improvement for substrate manufacturers. ENTEK PLUS IC’s industry leading thickness capability allows unrivalled shelf life of 24 months, providing supply chain flexibility and performance risk elimination associated with other OSP’s. With proven resistance to de-flux materials, ENTEK PLUS IC OSP maintains thickness through cleaning operations, delivering reliable performance for subsequent assembly operations ensuring yield maximization. ENTEK PLUS IC OSP forms a copper-tin intermetallic producing the strongest possible solder joint. Working in collaboration with Alpha Assembly ENTEK PLUS IC’s interaction with assembly materials has been optimized and verified through extensive solder-spread, ball-shear and drop shock testing. Product Features Industry leading OSP coating thickness capability. 24-month shelf life under best practice packaging and storage. Visually unchanged retaining performance after multiple N2 reflows. Significant minimization of OSP thickness reduction through de-flux providing protection of copper surfaces for further assembly. Optimized interaction with assembly materials for BGA ball attach technologies.

Organic Solderability Preservative (OSP) for Integrated Circuit (IC) substrate applications.

Product Overview

The ENTEK Organic Solderability Preservative (OSP) brand is the industry’s most trusted and widely used on the market today! ENTEK PLUS IC is the latest addition to the ENTEK OSP family, providing performance and yield improvement for substrate manufacturers.

ENTEK PLUS IC’s industry leading thickness capability allows unrivalled shelf life of 24 months, providing supply chain flexibility and performance risk elimination associated with other OSP’s. With proven resistance to de-flux materials, ENTEK PLUS IC OSP maintains thickness through cleaning operations, delivering reliable performance for subsequent assembly operations ensuring yield maximization.

ENTEK PLUS IC OSP forms a copper-tin intermetallic producing the strongest possible solder joint. Working in collaboration with Alpha Assembly ENTEK PLUS IC’s interaction with assembly materials has been optimized and verified through extensive solder-spread, ball-shear and drop shock testing.


Product Features

  • Industry leading OSP coating thickness capability.
  • 24-month shelf life under best practice packaging and storage.
  • Visually unchanged retaining performance after multiple N2 reflows.
  • Significant minimization of OSP thickness reduction through de-flux providing protection of copper surfaces for further assembly.
  • Optimized interaction with assembly materials for BGA ball attach technologies.
Supplier's Site Datasheet

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Name ENTEK PLUS IC
Unlock Full Specs
to access all available technical data

Similar Products

Shadow ® -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
View Details
Leadframe Packaging -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
View Details
Memory Disk -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
View Details
Systek SAP for IC Substrates -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
View Details