MacDermid Alpha Electronics Solutions ENTEK ® PLUS IC

Organic solderability preservative (OSP) for IC substrate fabrication with industry leading OSP coating thickness capability. Product Overview ENTEK® PLUS IC Organic Solderability Preservative’s (OSP) industry leading thickness capability allows unrivalled shelf life, providing supply chain flexibility and performance risk elimination associated with other OSP’s. With proven resistance to de-flux materials, ENTEK® PLUS IC OSP maintains thickness through cleaning operations, delivering reliable performance for subsequent assembly operations ensuring yield maximization. Industry Leading OSP Coating Thickness Capability Provides greatly increased protection to copper surfaces on storage when compared to competitive OSP coatings. Performance Risk Elimination The process enables 24-month shelf life under best practice storage, and is visually unchanged after multiple nitrogen reflows, retaining optimum performance. Strongest Possible Solder Joints ENTEK PLUS IC’s interaction with assembly materials has been optimized and verified through extensive solder-spread, ball-shear and drop shock testing.