Product Overview
ENTEK® PLUS IC Organic Solderability Preservative’s (OSP's) industry leading thickness capability allows unrivalled shelf life, providing supply chain flexibility and performance risk elimination associated with other OSP’s. With proven resistance to de-flux materials, ENTEK PLUS IC OSP maintains thickness through cleaning operations, delivering reliable performance for subsequent assembly operations ensuring yield maximization.
Product Features
Industry Leading OSP Coating Thickness Capability
Provides greatly increased protection to copper surfaces on storage when compared to competitive OSP coatings.
Performance Risk Elimination
The process enables 24-month shelf life under best practice storage, and is visually unchanged after multiple nitrogen reflows, retaining optimum performance.
Strongest Possible Solder Joints
ENTEK PLUS IC’s interaction with assembly materials has been optimized and verified through extensive solder-spread, ball-shear and drop shock testing.
Featured Applications
Mobile Devices
Extensive drop-shock testing to the IPC/JEDEC-9706 standard shows ENTEK PLUS IC produces a solder joint with the highest reliability when exposed to free fall impact.
Automotive
ENTEK PLUS IC provides performance and yield improvements for complex designs.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Cleaning Agents and Surface Treatments |
| Product Number | ENTEK ® PLUS IC |
| Product Name | Organic Solder Preservatives (OSP) Surface Finish for PCBs |
| Type | Surface Treatment; Cleaner |
