MacDermid Alpha Electronics Solutions ENEPIG Surface Finish for PCBs Affinity ™ ENEPIG

Product Overview The Affinity Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) process is easy to operate, providing uniform nickel, palladium, and gold deposits with high reliability for soldering and wire bonding applications at the lowest cost of ownership. The proprietary nickel, palladium, and gold baths offer chemical stability during intermittent operation without wasteful plating on equipment. Product Features Superior Wire Bond Performance and Solderability The nickel and palladium deposits are consistently uniform and, when paired with hybrid gold deposition, deliver a corrosion-free, highly solderable, and wire-bondable surface. Corrosion Free Deposition Affinity ENEPIG creates a corrosion-free surface, enhancing product reliability. Significant Cost of Ownership Improvement Cost improvements through extremely stable bath chemistry, simplified bath control, elimination of dummy plating, and reduced chemical waste and maintenance. Featured Applications Integrated Circuit (IC) Substrates Affinity ENEPIG is designed for critical applications where six-sigma assembly performance and mission-critical reliability are required.