MacDermid Alpha Electronics Solutions Panel Level Packaging Metallization Solutions CircuEtch 300

Product Overview CircuEtch 300 is a high-performance flash etching process for Semi-Additive Processing (SAP) in Integrated Circuit (IC) substrates and Panel Level Packaging (PLP). Designed for precision, it cleanly etches copper at the base of traces without undercut, preserving trace shapes and ensuring strong adhesion to the substrate. This robust, stable process delivers consistent etch rates across a broad operating window, accommodating variations in copper type, sulfuric acid concentration, temperature, and additive levels. CircuEtch 300 excels in etching a variety of copper types including electroless and sputtered copper, carefully treating electroplated pattern plates to maintain critical circuit dimensions. Product Features Optimal Circuit Geometry and Adhesion CircuEtch 300 provides vertical trace sidewalls without undercut for optimal circuit geometry and adhesion. Reduced Surface Roughness Reduced surface roughness improves electrical properties. Predictable Etching Rate CircuEtch 300 is capable of etching up to 5 μm/min of base layer copper at 30°C and provides a stable, predictable etching rate under a variety of conditions. Ease of Maintenance Simple peroxide-sulfuric based bath composition for ease of maintenance.