Product Overview
ALPHA TrueHeight Preforms contain embedded bondline control wires that maintain a minimum bondline of the solder joint after reflow, ensuring solder joint reliability. Multiple bondline control mechanisms can be included in a single solder preform to prevent tilt while ensuring a minimum bondline for applications such as warped substrate soldering. These preforms are available in a wide range of sizes, suitable for clip attachment, as well as substrate and heat spreader attachment applications.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | ALPHA ® TrueHeight ® Solder Preforms For Power Electronics |
| Product Name | Precision Preforms for Power Module Assembly |
| Joining Process / Product Form | Flux Cored Wire |
