Product Overview
ALPHA OM-100 SnCX 07 is a silver-free solder paste engineered to deliver Tin-Silver-Copper (SAC) comparable reliability with improved total cost of ownership. Ideal for cost-sensitive applications, this solution increases profitability with every assembly.
With an average 50% improvement in mechanical strain resistance over SAC305-based solder pastes, ALPHA OM-100 SnCX 07 significantly extends the service life of white goods and smart home electronics assemblies, where environmental incursions such as vibration and drop shock are major concerns.
Engineered for both exceptional performance and cost efficiency, this versatile paste maximizes value without compromising reliability.
Product Features
Superior Mechanical Performance
Proven 50% improvement in characteristic life over SAC305 for white goods and smart consumer electronics applications.
Total Cost of Ownership (TCO) Optimization
Offers up to 30% metal savings compared to Tin-Silver-Copper (SAC) based alloys, optimizing total cost of ownership.
TCT Performance
Provides Thermal Cycle Test (TCT) performance comparable to SAC305 for applications operating below 100 °C.
Excellent Processability
Optimized for tighter processing windows and offering up to 16 hours of stencil life.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | ALPHA ® OM-100 SnCX ® 07 Solder Paste |
| Product Name | Solder Paste Materials for Printed Circuit Boards (PCB) |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
