Product Overview
ALPHA OM-5100 Solder Paste is a low-residue, no-clean solder paste designed to maximize first-pass yields. The ALPHA OM-5100 activation system is optimized to enhance joint solderability and minimize post-reflow soldering defects.
This paste's wide reflow profile window enables soldering with lead-free components. ALPHA OM-5100 is engineered for complex assemblies with small (0201) tin-finished passives and ensures solderability with large (1mm pitch) Ball Grid Array (BGA) components containing lead-free spheres. Small print deposits remain fully coalesced, even in profiles hot enough to collapse SAC305 BGA spheres.
Product Features
Consistent Fine-Feature Print Volume Repeatability
Low Post-Reflow Residue
Reduction in Mid-Chip Solder Ball Defects
Minimizes Random Solder Balling
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | ALPHA ® OM-5100 Solder Paste |
| Product Name | Solder Paste Materials for Printed Circuit Boards (PCB) |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
