A one-component capillary underfill for protecting assembled chip packages on printed circuit boards. Its high Tg, low CTE properties protects the solder joints from mechanical stresses.
Product Overview
ALPHA HiTech CU11-3127, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages.
ALPHA HiTech CU11-3127 has a unique low viscosity property, making it possible to secure full coverage flow at room temperature without preheat. For a faster flow rate, preheat of < 80°C is recommended on substrates during dispensing process.
Product Features
Enabling fast and efficient flow properties at high temperature but must be <80°C
Releases stress over a large area, primary stress is CTE mismatch between component and board
High Glass Transition Temperature
Low Coefficient of Thermal Expansion
Halogen Free Complies with RoHS Directive 2011/65/EU
A one-component capillary underfill for protecting assembled chip packages on printed circuit boards. Its high Tg, low CTE properties protects the solder joints from mechanical stresses.
Product Overview
ALPHA HiTech CU11-3127, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages.
ALPHA HiTech CU11-3127 has a unique low viscosity property, making it possible to secure full coverage flow at room temperature without preheat. For a faster flow rate, preheat of < 80°C is recommended on substrates during dispensing process.
Product Features
- Enabling fast and efficient flow properties at high temperature but must be <80°C
- Releases stress over a large area, primary stress is CTE mismatch between component and board
- High Glass Transition Temperature
- Low Coefficient of Thermal Expansion
- Halogen Free Complies with RoHS Directive 2011/65/EU
