MacDermid Alpha Electronics Solutions STAYSTIK ® 336T

Solvent-based Polymer Specially Developed for Temporary Bonding Applications Product Overview STAYSTIK 336T thermoplastic adhesive paste is a low modulus polymer specially developed for temporary bonding applications most typically associated with GaAs and silicon wafer thinning. It can also be used for a variety of applications were temporary adhesion is necessary. This adhesive can be easily debonded in Isopropyl Alcohol (I.P.A.) leaving no residue or contamination on the surface of the debonded assembly. Features Fast bonding to a variety of substrates Easily reworkable material