MIC-6110 is a 6U OpenVPX MXM carrier. MIC-6110 complies with the MOD6-PER-4F-12.3.1-3 profile, and the newest MXM specification rev. 3.1. Connecting to the Dataplane by the PCIE fabric x 16, MIC-6110 is capable to leverage the advantages of the MXM module with the optimized performance. Offering up to four independent display outputs, MIC-6110 can auto-select the outputs between the backplane and the front panel I/O to fulfill the requirement of the multiple displays. With the selected MXM, MIC-6110 offers the great computing ability for assisting the main processor board computation. With the native design for the maximum compatibility of mechanical structures, MIC-6110 can be adapted to all sorts of 6U OpenVPX chassis, and is reliable to bear the harsh operational conditions such as the extreme temperature, shock, and vibration.
OpenVPX MOD6-PER-4F-12.3.1-3 profile compliant
MXM 3.1 type A/type B compliant
Up to 4 independent outputs
PCIE fabric interface
Ruggedized convection cooled thermal solution
MIC-6110 is a 6U OpenVPX MXM carrier. MIC-6110 complies with the MOD6-PER-4F-12.3.1-3 profile, and the newest MXM specification rev. 3.1. Connecting to the Dataplane by the PCIE fabric x 16, MIC-6110 is capable to leverage the advantages of the MXM module with the optimized performance. Offering up to four independent display outputs, MIC-6110 can auto-select the outputs between the backplane and the front panel I/O to fulfill the requirement of the multiple displays. With the selected MXM, MIC-6110 offers the great computing ability for assisting the main processor board computation. With the native design for the maximum compatibility of mechanical structures, MIC-6110 can be adapted to all sorts of 6U OpenVPX chassis, and is reliable to bear the harsh operational conditions such as the extreme temperature, shock, and vibration.
- OpenVPX MOD6-PER-4F-12.3.1-3 profile compliant
- MXM 3.1 type A/type B compliant
- Up to 4 independent outputs
- PCIE fabric interface
- Ruggedized convection cooled thermal solution
