5G NR FR1 module, M.2 3052 B-Key form factor, USB interface
Main Chipset Qualcomm SDX62
Max DL peak rate 3.2 Gbps NR Sub6 EN-DC, Max UL peak rate of 900Mbps
UL Max support 2 MIMO, DL Max support 4 MIMO
M.2 3052 form factor, USB interface
Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F)
AIW-356 DQ-N01: 5G NR FR1 module, USB communication interface, with GNSS, for US
AIW-356 DQ-E01: 5G NR FR1 module, USB communication interface, with GNSS, for EU, for Australia
AIW-356 DQ-JK1: 5G NR FR1 module, USB communication interface, with GNSS, for Japan, for South Korea
AIW-356 DQ-C01: 5G NR FR1 module, USB communication interface, with GNSS, for China
5G NR FR1 module, M.2 3052 B-Key form factor, USB interface
- Main Chipset Qualcomm SDX62
- Max DL peak rate 3.2 Gbps NR Sub6 EN-DC, Max UL peak rate of 900Mbps
- UL Max support 2 MIMO, DL Max support 4 MIMO
- M.2 3052 form factor, USB interface
- Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F)
- AIW-356 DQ-N01: 5G NR FR1 module, USB communication interface, with GNSS, for US
- AIW-356 DQ-E01: 5G NR FR1 module, USB communication interface, with GNSS, for EU, for Australia
- AIW-356 DQ-JK1: 5G NR FR1 module, USB communication interface, with GNSS, for Japan, for South Korea
- AIW-356 DQ-C01: 5G NR FR1 module, USB communication interface, with GNSS, for China
