AMADA Weld Tech Standalone Basic Hot Bar Bonding System UniBase

Description
The stand-alone Uni-Base hot bar reflow soldering system is the first in a line of (semi-) automatic systems developed for Hot Bar Reflow Soldering, Heat-Sealing and ACF-bonding. Flexible enough for R&D environments or volume manufacturing where automation is not necessary. Typical product applications are connection of components like an LCD display, small size TFT, glass substrate based OLED, polyimide mounted TCP driver, and a diversity of heat-sensitive components like CCD camera chips. Uniflow2 Pulse Heated Control High precision motorized or pneumatic bonding head Quick Connect Block with pulse-heated Thermo-plane thermode Two hand operation for operator safety
Description
The stand-alone Uni-Base hot bar reflow soldering system is the first in a line of (semi-) automatic systems developed for Hot Bar Reflow Soldering, Heat-Sealing and ACF-bonding. Flexible enough for R&D environments or volume manufacturing where automation is not necessary. Typical product applications are connection of components like an LCD display, small size TFT, glass substrate based OLED, polyimide mounted TCP driver, and a diversity of heat-sensitive components like CCD camera chips. Uniflow2 Pulse Heated Control High precision motorized or pneumatic bonding head Quick Connect Block with pulse-heated Thermo-plane thermode Two hand operation for operator safety

Suppliers

Company
Product
Description
Supplier Links
Standalone Basic Hot Bar Bonding System - UniBase - AMADA Weld Tech
Monrovia, CA, United States
Standalone Basic Hot Bar Bonding System
UniBase
Standalone Basic Hot Bar Bonding System UniBase
The stand-alone Uni-Base hot bar reflow soldering system is the first in a line of (semi-) automatic systems developed for Hot Bar Reflow Soldering, Heat-Sealing and ACF-bonding. Flexible enough for R&D environments or volume manufacturing where automation is not necessary. Typical product applications are connection of components like an LCD display, small size TFT, glass substrate based OLED, polyimide mounted TCP driver, and a diversity of heat-sensitive components like CCD camera chips. Uniflow2 Pulse Heated Control High precision motorized or pneumatic bonding head Quick Connect Block with pulse-heated Thermo-plane thermode Two hand operation for operator safety

The stand-alone Uni-Base hot bar reflow soldering system is the first in a line of (semi-) automatic systems developed for Hot Bar Reflow Soldering, Heat-Sealing and ACF-bonding. Flexible enough for R&D environments or volume manufacturing where automation is not necessary. Typical product applications are connection of components like an LCD display, small size TFT, glass substrate based OLED, polyimide mounted TCP driver, and a diversity of heat-sensitive components like CCD camera chips.

  • Uniflow2 Pulse Heated Control
  • High precision motorized or pneumatic bonding head
  • Quick Connect Block with pulse-heated Thermo-plane thermode
  • Two hand operation for operator safety
Supplier's Site

Technical Specifications

  AMADA Weld Tech
Product Category Welding, Brazing, and Soldering Equipment
Product Number UniBase
Product Name Standalone Basic Hot Bar Bonding System
Equipment Type Complete System; PowerSource / Station; Weld Monitor or Controller
Process Capability Reflow; Soldering Stations, Irons & Accessories
AC Input Voltage 115/120V_60Hz (optional feature); 208-230/240V_60Hz; International Power or Voltages - 50 Hz
Input Current ? to 16 amps
Input Phase Single Phase Power
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