Advanced Technical Ceramics Company Datasheets for Electronic Packages and Lids

Electronic Packages and Lids are used in the microelectronic and fiber optic industry. Packages and lids are used to enclose electronic chips and interface with circuit boards. They are typicaly customized to customer requirements.
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Product Name Notes
AdTech’s line of Platinum co-fired packages combines the HTCC material system with platinum metal conductors. Screen printing Pt with hermetic vias using multilayer capability addresses harsh environmental and biocompatible applications.