Your benefits
Thermal impedance 0.52°C-in²/W (@50 psi)
High bond strength to a variety of surfaces
Double-sided, pressure sensitive adhesive tape
High performance, thermally conductive acrylic adhesive
Can be used instead of heat-cure adhesive, screw mounting or clip mounting. Applications
Mount heat sink onto BGA graphic processor or drive processor
Mount heat spreader onto power converter PCB or onto motor control PCB
Bond-Ply 100 Downloads Selection Guide RoHS Certificate Halogen Testing Report SDS 简体中文 SDS Český SDS English EU SDS English US SDS Français SDS Deutsch SDS Italiano SDS 日本語 SDS 한국어 SDS Slovenčina
Your benefits
- Thermal impedance 0.52°C-in²/W (@50 psi)
- High bond strength to a variety of surfaces
- Double-sided, pressure sensitive adhesive tape
- High performance, thermally conductive acrylic adhesive
- Can be used instead of heat-cure adhesive, screw mounting or clip mounting.
Applications
- Mount heat sink onto BGA graphic processor or drive processor
- Mount heat spreader onto power converter PCB or onto motor control PCB
Bond-Ply 100 Downloads
Selection Guide
RoHS Certificate
Halogen Testing Report
SDS 简体中文
SDS Český
SDS English EU
SDS English US
SDS Français
SDS Deutsch
SDS Italiano
SDS 日本語
SDS 한국어
SDS Slovenčina
