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Shiu Li Technology Co., Ltd 5G mmWave Thermal Conductive Gel Pad DTT44-s

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5G mmWave Thermal Conductive Gel Pad - DTT44-s - Shiu Li Technology Co., Ltd
Taoyuan City, Taiwan
5G mmWave Thermal Conductive Gel Pad
DTT44-s
5G mmWave Thermal Conductive Gel Pad DTT44-s
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide range of applications.

LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide range of applications.

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Technical Specifications

  Shiu Li Technology Co., Ltd
Product Category Industrial Sealants
Product Number DTT44-s
Product Name 5G mmWave Thermal Conductive Gel Pad
Type / Form Sheet or Film
Chemical System Silicone
Features Thermally Conductive; UL Rating
Industry Electronics
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