Gap Pad A2000 acts as a thermal interface and electrical insulator between electrical components and heat sinks. In the thickness range of 10 to 40 mil, Gap Pad A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mil material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework. Your benefits
Thermal conductivity: 2.0 W/m-K
Fiberglass reinforced for puncture, shear and tear resistance
Electrically isolating Applications
Computer and peripherals; between CPU and heat spreader
Telecommunications
Heat Pipe assemblies
RDRAM™ memory modules
CDROM / DVD cooling
Area where heat needs to be transferred to a frame chassis or other type of heat spreader
DDR SDRAM memory modules
Gap Pad A2000 Downloads Selection Guide RoHS Certificate Halogen Testing Report SDS 简体中文 SDS English EU SDS Deutsch Application Note 116
Gap Pad A2000 acts as a thermal interface and electrical insulator between electrical components and heat sinks. In the thickness range of 10 to 40 mil, Gap Pad A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mil material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework.
Your benefits
- Thermal conductivity: 2.0 W/m-K
- Fiberglass reinforced for puncture, shear and tear resistance
- Electrically isolating
Applications
- Computer and peripherals; between CPU and heat spreader
- Telecommunications
- Heat Pipe assemblies
- RDRAM™ memory modules
- CDROM / DVD cooling
- Area where heat needs to be transferred to a frame chassis or other type of heat spreader
- DDR SDRAM memory modules
Gap Pad A2000 Downloads
Selection Guide
RoHS Certificate
Halogen Testing Report
SDS 简体中文
SDS English EU
SDS Deutsch
Application Note 116
