The PK605 Thermal Conductive Gel Pad from Shiu Li Technology Co., Ltd. features a thermal conductivity of 6.0 W/m*K, making it suitable for effective heat dissipation in various applications. It has a Shore hardness rating of OO/60, indicating high flexibility and compressibility, which allows it to conform to surfaces and fill gaps effectively. The gel pad is naturally tacky, facilitating ease of use during manufacturing processes. It is available in customized thicknesses and can be molded into specific shapes as needed. The product is compliant with ROHS and REACH regulations, ensuring it meets environmental safety standards. Typical applications include notebook computers, heat pipe assemblies, memory modules, automotive electronics, and mobile devices. The operating temperature range is from -60°C to 180°C, making it versatile for different environments.
LiPOLY’s PK605 is a material designed for gap filling. The thermal conductivity is 6.0 W/m*K. The hardness is Shore 00/60 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers customized shape molding service.
| Shiu Li Technology Co., Ltd | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | PK605 |
| Product Name | Thermal Conductive Gel Pad |
| Type / Form | Sheet or Film |
| Chemical System | Silicone |
| Features | Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating |
| Industry | Electronics |
