3M,Ñ¢ Scotch-Weld,Ñ¢ Structural Adhesive Film AF 163-2 is a thermosetting modified epoxy adhesive film suitable for solid panel and honeycomb sandwich constructions. It exhibits high bond strength across a temperature range from -67¬8F to 250¬8F, along with high fracture toughness and peel strength. The film demonstrates excellent resistance to moisture both before and after curing, making it suitable for various environmental conditions. It has a short cure time of 90 minutes at 225¬8F and can be applied using low pressure bonding techniques. The product is also X-ray opaque, allowing for non-destructive inspection methods. Various versions of the film are available, including unsupported and higher tack options, catering to different application needs. The recommended storage conditions are at 0¬8F or below to maximize shelf life, which is 12 months from the date of shipment.
Designed for both solid panel and honeycomb sandwich constructions. High bond strength from -67F to 250F. High fracture toughness and peel strength. Excellent resistance to high moisture environments before and after curing. Short cure time at 225F (90 minutes). Capable of low pressure bonding.
| 3M Aerospace and Aircraft Maintenance Division | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | AF 163-2 |
| Product Name | 3M™ Scotch-Weld™ Structural Adhesive Film |
| Cure / Technology | Thermoset; Single Component |
| Chemical System | Epoxy |
| Type / Form | Sheet or Film |
