3M 3M Scotch-Weld HP45 Gasket Adhesive/Sealant - Purple Liquid 50 ml Bottle - 62721 62347750606

Description
3M Scotch-Weld HP45 purple gasket adhesive/sealant with a 24 hr cure time. Minimum to maximum operating temperatures are -65 F to +300 F.
  • 3M Scotch-Weld HP45 Gasket Adhesive/Sealant - Purple Liquid 50 ml Bottle - 62721 - 048011-62721 - R. S. Hughes Company, Inc.
    R. S. Hughes Company, Inc.
Description
3M Scotch-Weld HP45 purple gasket adhesive/sealant with a 24 hr cure time. Minimum to maximum operating temperatures are -65 F to +300 F.

Suppliers

Company
Product
Description
Supplier Links
3M Scotch-Weld HP45 Gasket Adhesive/Sealant - Purple Liquid 50 ml Bottle - 62721 - 048011-62721 - R. S. Hughes Company, Inc.
R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
3M Scotch-Weld HP45 Gasket Adhesive/Sealant - Purple Liquid 50 ml Bottle - 62721
048011-62721
3M Scotch-Weld HP45 Gasket Adhesive/Sealant - Purple Liquid 50 ml Bottle - 62721 048011-62721
3M Scotch-Weld HP45 purple gasket adhesive/sealant with a 24 hr cure time. Minimum to maximum operating temperatures are -65 F to +300 F.

3M Scotch-Weld HP45 purple gasket adhesive/sealant with a 24 hr cure time. Minimum to maximum operating temperatures are -65 F to +300 F.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Industrial Sealants
Product Number 048011-62721
Product Name 3M Scotch-Weld HP45 Gasket Adhesive/Sealant - Purple Liquid 50 ml Bottle - 62721
Type / Form Liquid
Unlock Full Specs
to access all available technical data

Similar Products

C-SHIELD RF Conductive Caulking Compound and Sealer - - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
C-SHIELD RF Conductive Caulking Compound and Sealer
Specs
Type / Form Liquid
Features Caulk, Grout; Electrically Conductive
View Details
Thermally Conductive, Dimensionally Stable Epoxy - EP21AO - Master Bond, Inc.
Master Bond, Inc.
Thermally Conductive, Dimensionally Stable Epoxy
EP21AO
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
View Details
Liquid Gap Fillers for Electronics - Electrolube ® LGF200 Liquid Gap Filler - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Liquid Gap Fillers for Electronics
Electrolube ® LGF200 Liquid Gap Filler
Specs
Cure / Technology Two Component  
Type / Form Liquid
Features Electrically Conductive; Leveling Filling; Gap Filler, Foam in Place Gasket; Thermally Conductive
View Details
Epoxylite® - E 5403 Hi Temp Epoxy Kit - ELANTAS North America LLC
ELANTAS North America LLC
Epoxylite®
E 5403 Hi Temp Epoxy Kit
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Grease, Paste
Substrate Compatibility Dissimilar Substrates
View Details