Two part epoxy resin potting and encapsulating compound supplied in handy 250g duo-sachet pack for easy mixing and pouring with no mess. Fast curing, low viscosity epoxy resin for RF applications. The cured product is tough and exhibits good adhesion to a variety of substrates.
Good electrical properties. RF applications â dielectric constant 4.7 @10kHz. High water resistance. Excellent adhesive properties. Cure time 12 hours @ 20°C . Non toxic . Easy to use. Good thermal cycling characteristics
Product Material = Epoxy
Package Type = Pack
Package Size = 250 g
Special Properties = Water Resistance
Cure Time = 2 h
Hardness = 70 Shore A
Colour = White
Maximum Operating Temperature = +150°C
Minimum Operating Temperature = -50°C
Operating Temperature Range = -50 - +150 °C
RS Components, Ltd. | |
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Product Category | Encapsulants and Potting Compounds |
Product Number | 164321 |
Form / Function | Pack |